W25Q16BVSFIG Winbond Electronics, W25Q16BVSFIG Datasheet - Page 7

• Manufacturer Part Number: W25Q16BVSFIG
• Description: IC SPI FLASH 16MBIT 16SOIC
• Manufacturer: Winbond Electronics

Specifications of W25Q16BVSFIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 16-SOIC (0.300", 7.5mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

6. PIN DESCRIPTION SOIC 150/208-MIL, PDIP 300-MIL AND WSON 6X5-MM
*1 IO0 and IO1 are used for Standard and Dual SPI instructions
*2 IO0 – IO3 are used for Quad SPI instructions
5. PAD CONFIGURATION PDIP 300-MIL
PIN NO.
1
2
3
4
5
6
7
8
/HOLD (IO3)
PIN NAME
/WP (IO2)
DO (IO1)
DI (IO0)
GND
VCC
CLK
/CS
/WP (IO
/WP (IO
DO (IO
DO (IO
Figure 1c. W25Q16BV Pin Assignments, 8-pin PDIP (Package Code DA)
GND
GND
/CS
/CS
1
1
2
2
)
)
)
)
I/O
I/O
I/O
I/O
I/O
I
I
1
1
2
2
3
3
4
4
Chip Select Input
Data Output (Data Input Output 1)*
Write Protect Input ( Data Input Output 2)*
Ground
Data Input (Data Input Output 0)*
Serial Clock Input
Hold Input (Data Input Output 3)*
Power Supply
- 7 -
8
8
7
7
6
6
5
5
FUNCTION
Publication Release Date: July 08, 2010
VCC
VCC
/HOLD (IO
/HOLD (IO
CLK
CLK
DI (IO
DI (IO
0
0
2
1
)
)
1
3
3
)
)
2
W25Q16BV
Revision F