CAT24C02YI-GT3 ON Semiconductor, CAT24C02YI-GT3 Datasheet
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CAT24C02YI-GT3
Specifications of CAT24C02YI-GT3
CAT24C02YI-GT3TR
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CAT24C02YI-GT3 Summary of contents
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... Data is written by providing a starting address, then loading contiguous bytes into a Page Write Buffer, and then writing all data to non−volatile memory in one internal write cycle. Data is read by providing a starting address and then shifting out data serially while automatically incrementing the internal address count. ...
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V CC SCL CAT24Cxx Figure 1. Functional Symbol Table 2. ABSOLUTE MAXIMUM RATINGS Parameters Storage Temperature Voltage on any pin with respect to Ground (Note 1) Stresses exceeding Maximum ...
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Table 5. PIN IMPEDANCE CHARACTERISTICS ( −40°C to +125°C and Symbol Parameter C (Note 4) SDA Pin Capacitance IN Other Pins I (Note 5) WP Input Current WP I ...
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Table 7. A.C. TEST CONDITIONS Input Drive Levels Input Rise and Fall Time Input Reference Levels Output Reference Level Output Test Load Power−On Reset (POR) Each CAT24Cxx* incorporates Power−On Reset (POR) circuitry which protects the internal logic against powering up ...
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SCL SDA START CONDITION BUS RELEASE DELAY (TRANSMITTER) SCL FROM MASTER DATA OUTPUT FROM TRANSMITTER DATA OUTPUT FROM RECEIVER START SCL t SU:STA t HD:SDA ...
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... CAT24Cxx. After receiving another acknowledge from the Slave, the Master transmits the data byte to be written into the addressed memory location. The CAT24Cxx device will acknowledge the data byte and the Master generates the STOP condition, at which time the device begins its internal Write cycle to nonvolatile memory (Figure 6) ...
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SCL th SDA 8 Bit Byte n S BUS ACTIVITY SLAVE R MASTER ADDRESS SLAVE ADDRESS BYTE 1 SCL a 7 SDA WP ACK t WR STOP ...
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... NoACK, followed by a STOP (Figure 12). In contrast to Page Write, during Sequential Read the address count will automatically increment to and then wrap−around at end of memory (rather than end of page). In the CAT24C01, the internal address count will not wrap around at the end of the 128 byte memory space. ...
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PIN # 1 IDENTIFICATION D TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MS-001. PACKAGE DIMENSIONS PDIP−8, 300 mils CASE 646AA−01 ISSUE A SYMBOL ...
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PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O SYMBOL ...
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E1 e TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O SYMBOL MIN A A1 0.05 A2 ...
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E E1 TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-187. PACKAGE DIMENSIONS MSOP 8, 3x3 CASE 846AD−01 ISSUE O SYMBOL MIN A A1 ...
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D E PIN#1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.70 0.75 A1 0.00 0.02 A2 0.45 0.55 A3 0.20 REF b 0.20 0.25 D 1.90 2.00 D2 1.30 1.40 E 2.90 3.00 E2 1.20 1.30 e 0.50 TYP ...
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TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-193. PACKAGE DIMENSIONS TSOT−23, 5 LEAD CASE 419AE−01 ISSUE O SYMBOL MIN A A1 0.01 A2 ...
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D E PIN #1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.45 0.50 A1 0.00 0.02 A3 0.127 REF b 0.20 0.25 D 1.95 2.00 D2 1.35 1.40 E 2.95 3.00 E2 1.25 1.30 e 0.50 REF L 0.25 ...
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... OUTLINE 4X 0.40 PITCH 0.40 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS WLCSP4, 0.856x0.832 CASE 567DC−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME 2 ...
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... OUTLINE 5X 0.52 PITCH 0.30 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS WLCSP5, 0.832x0.856 CASE 567DD−01 ISSUE O NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME 2 ...
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... For availability, please contact your nearest ON Semiconductor Sales Office. 13. Not recommended for new designs. Please replace with UDFN (HU4) package. 14. For CAT24C02 Gresham only die, please use the following OPNs: CAT24C02LI-GA, CAT24C02WI-GT3A, CAT24C02YI-GT3A, CAT24C02ZI-GT3A, CAT24C02VP2IGT3A, CAT24C02TDI-GT3A, CAT24C02HU4IGT3A, CAT24C02LE-GA, CAT24C02WE-GT3A, CAT24C02YE-GT3A, CAT24C02ZE-GT3A, CAT24C02VP2EGT3A, CAT24C02TDE-GT3A or CAT24C02HU4EGT3A. ...