W25X20BVSNIG Winbond Electronics, W25X20BVSNIG Datasheet - Page 33

• Manufacturer Part Number: W25X20BVSNIG
• Description: IC SPI FLASH 2MBIT 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X20BVSNIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 2M (256K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

W25X10BV/20BV/40BV
9.2.20 Read Manufacturer / Device ID (90h)
The Read Manufacturer/Device ID instruction is an alternative to the Release from Power-down/
Device ID instruction that provides both JEDEC assigned manufacturer ID and the specific device ID.
The Read Manufacturer/Device ID instruction is very similar to the Release from Power-down / Device
ID instruction. The instruction is initiated by driving the /CS pin low and shifting the instruction code
“90h” followed by a 24-bit address (A23-A0) of 000000h. After which, the Manufacturer ID for Winbond
(EFh) and the Device ID are shifted out on the falling edge of CLK with most significant bit (MSB) first
as shown in figure 21. The Device ID values for the W25X10BV/20BV/40BV are listed in Manufacturer
and Device Identification table. If the 24-bit address is initially set to 000001h the Device ID will be
read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read
continuously, alternating from one to the other. The instruction is completed by driving /CS high.
Figure 21. Read Manufacturer / Device ID Diagram
Publication Release Date: August 20, 2009
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Preliminary -- Revision B