W25X40BVDAIG Winbond Electronics, W25X40BVDAIG Datasheet - Page 44

• Manufacturer Part Number: W25X40BVDAIG
• Description: IC SPI FLASH 4MBIT 8PDIP
• Manufacturer: Winbond Electronics

Specifications of W25X40BVDAIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 4M (512K x 8)
• Speed: 104MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

11.1 8-Pin SOIC 150-mil (Package Code SN)
Notes:
1. Controlling dimensions: millimeters, unless otherwise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash protrusions and should be measured from the bottom of the package.
4. Formed leads coplanarity with respect to seating plane shall be within 0.004 inches
11. PACKAGE SPECIFICATION
SEATING PLANE
Y
8

1
SYMBOL
D
E
Y
e
A1
H
A
b

c
L
(2)
(4)
(3)
(3)
E
b
D
e
1.35
0.10
0.33
0.19
3.80
4.80
5.80
0.40
Min
0°
-
5
4
MILLIMETERS
1.27 BSC
A1
- 44 -
A
E
H
E
Max
0.51
0.25
4.00
5.00
6.20
0.10
1.75
0.25
1.27
10°
W25X10BV/20BV/40BV
.
0.053
0.004
0.013
0.008
0.150
0.188
0.228
0.016
Min
0°
-
0.050 BSC
INCHES
0.069
0.010
0.020
0.010
0.157
0.196
0.244
0.004
0.050
Max
10°
0.25
GAUGE PLANE
c
L
O