CAT24C32WI-G ON Semiconductor, CAT24C32WI-G Datasheet
CAT24C32WI-G
Specifications of CAT24C32WI-G
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CAT24C32WI-G Summary of contents
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... Supports Standard, Fast and Fast−Plus I • 1 5.5 V Supply Voltage Range • 32−Byte Page Write Buffer • Hardware Write Protection for Entire Memory • Schmitt Triggers and Noise Suppression Filters on I (SCL and SDA) • Low Power CMOS Technology • ...
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AXXX YYWWG 24C32F = Specific Device Code A = Assembly Location XXX = Last Three Digits of Assembly Lot Number YY = Production Year (Last Two Digits Production Week (Two Digits Pd-Free designator (TSSOP−8) ...
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Table 1. ABSOLUTE MAXIMUM RATINGS Parameters Storage Temperature Voltage on any Pin with Respect to Ground (Note 1) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is ...
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Table 5. A.C. CHARACTERISTICS ( −40°C to +125°C and Symbol Parameter F Clock Frequency SCL t START Condition Hold Time HD:STA t Low Period of SCL Clock LOW t ...
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Power-On Reset (POR) Each CAT24C32 incorporates Power-On Reset (POR) circuitry which protects the internal logic against powering up in the wrong state. The device will power up into Standby mode after V exceeds the POR trigger level and will CC ...
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... Slave, the Master simply repeats the request until the Slave responds with ACK. Hardware Write Protection With the WP pin held HIGH, the entire memory is protected against Write operations. If the WP pin is left floating or is grounded, it has no impact on the Write operation ...
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S BUS ACTIVITY SLAVE R MASTER ADDRESS T S SLAVE *a − a are don’t care bits 15 12 SCL SDA 8th Bit Byte n BUS ACTIVITY SLAVE ADDRESS MASTER R ADDRESS BYTE T S ...
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... If, after receiving data sent by the Slave, the Master responds with ACK, then the Slave will continue transmitting until the Master responds with NoACK followed by STOP (Figure 12). During Sequential Read the internal byte address is automatically incremented up to the end of memory, where it then wraps around to the beginning of memory ...
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PIN # 1 IDENTIFICATION D TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. (2) Complies with JEDEC MS-001. PACKAGE DIMENSIONS PDIP−8, 300 mils CASE 646AA−01 ISSUE A SYMBOL ...
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PIN # 1 IDENTIFICATION TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MS-012. PACKAGE DIMENSIONS SOIC 8, 150 mils CASE 751BD−01 ISSUE O SYMBOL ...
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E1 e TOP VIEW SIDE VIEW Notes: (1) All dimensions are in millimeters. Angles in degrees. (2) Complies with JEDEC MO-153. PACKAGE DIMENSIONS TSSOP8, 4.4x3 CASE 948AL−01 ISSUE O SYMBOL MIN A A1 0.05 A2 ...
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D E PIN #1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.45 0.50 A1 0.00 0.02 A3 0.127 REF b 0.20 0.25 D 1.95 2.00 D2 1.35 1.40 E 2.95 3.00 E2 1.25 1.30 e 0.50 REF L 0.25 ...
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D E PIN#1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.70 0.75 A1 0.00 0.02 A2 0.45 0.55 A3 0.20 REF b 0.20 0.25 D 1.90 2.00 D2 1.30 1.40 E 2.90 3.00 E2 1.20 1.30 e 0.50 TYP ...
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D E PIN #1 INDEX AREA TOP VIEW SYMBOL MIN NOM A 0.45 0.50 A1 0.00 0.02 A3 0.127 REF b 0.20 0.25 D 1.90 2.00 D2 1.50 1.60 E 2.90 3.00 E2 0.10 0.20 e 0.50 TYP K 0.10 ...
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... T SOLDERING FOOTPRINT* 1.9 0.074 0.95 0.037 1.0 0.039 0.7 0.028 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS TSOP−5 CASE 483−02 ISSUE H 0. DETAIL Z DETAIL ...
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... The device used in the above example is a CAT24C32YI−GT3 (TSSOP, Industrial Temperature, NiPdAu, Tape & Reel, 3,000/Reel). 14. For additional package and temperature options, please contact your nearest ON Semiconductor Sales office. 15. The TDFN 0.75 mm (VP2) and UDFN 0.5 mm (HU3) are not recommended for new design. Please replace with UDFN ...