NTLUS3A18PZTAG ON Semiconductor, NTLUS3A18PZTAG Datasheet
NTLUS3A18PZTAG
Specifications of NTLUS3A18PZTAG
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NTLUS3A18PZTAG Summary of contents
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NTLUS3A18PZ Power MOSFET −20 V, −8.2 A, Single P−Channel, 2.0x2.0x0.55 mm mCoolt UDFN Package Features • UDFN Package with Exposed Drain Pads for Excellent Thermal Conduction • Low Profile UDFN 2.0x2.0x0.55 mm for Board Space Saving • Ultra Low R ...
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THERMAL RESISTANCE RATINGS Junction-to-Ambient – Steady State (Note 3) Junction-to-Ambient – t ≤ (Note 3) Junction-to-Ambient – Steady State min Pad (Note 4) 3. Surface-mounted on FR4 board using pad size (Cu area = 1.127 ...
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−2 −1 0.0 0.5 1.0 1.5 2.0 2.5 −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 1. On−Region Characteristics 0.10 0.09 ...
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C 2800 iss 2400 2000 1600 1200 800 C oss 400 C rss −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 7. Capacitance Variation 1000.0 t d(off) 100 ...
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... DEVICE ORDERING INFORMATION Device NTLUS3A18PZTAG NTLUS3A18PZTBG NTLUS3A18PZTCG †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. TYPICAL CHARACTERISTICS V = − Single Pulse T = 25°C ...
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... PACKAGE 0.65 PITCH *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81− ...