BUK9606-40B /T3 NXP Semiconductors, BUK9606-40B /T3 Datasheet - Page 5

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BUK9606-40B /T3

Manufacturer Part Number
BUK9606-40B /T3
Description
MOSFET HIGH PERF TRENCHMOS
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BUK9606-40B /T3

Product Category
MOSFET
Rohs
yes
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 15 V
Continuous Drain Current
129 A
Resistance Drain-source Rds (on)
0.005 Ohms
Configuration
Single
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Package / Case
SOT-404
Fall Time
92 ns
Minimum Operating Temperature
- 55 C
Power Dissipation
203 W
Rise Time
145 ns
Factory Pack Quantity
800
Typical Turn-off Delay Time
132 ns
Part # Aliases
BUK9606-40B,118
NXP Semiconductors
5. Thermal characteristics
Table 5.
BUK9606-40B
Product data sheet
Symbol
R
R
Fig 4.
th(j-mb)
th(j-a)
Transient thermal impedance from junction to mounting base as a function of pulse duration
Thermal characteristics
Parameter
thermal resistance from junction
to mounting base
thermal resistance from junction
to ambient
Z
(K/W)
th(j-mb)
10
10
10
−1
−2
−3
1
10
−6
δ = 0.5
single shot
0.05
0.02
0.2
0.1
10
−5
All information provided in this document is subject to legal disclaimers.
Conditions
see
minimum footprint ; mounted on a PCB
10
Rev. 02 — 1 February 2011
−4
Figure 4
10
−3
10
−2
N-channel TrenchMOS logic level FET
P
10
t
−1
p
T
t
p
BUK9606-40B
Min
-
-
(s)
δ =
03nm22
t
T
t
p
1
Typ
-
50
© NXP B.V. 2011. All rights reserved.
-
Max
0.74
Unit
K/W
K/W
5 of 14

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