AT24C64N-10SI-1.8 Atmel, AT24C64N-10SI-1.8 Datasheet - Page 18
![IC EEPROM 64KBIT 400KHZ 8SOIC](/photos/6/50/65032/453-8-soic_sml.jpg)
AT24C64N-10SI-1.8
Manufacturer Part Number
AT24C64N-10SI-1.8
Description
IC EEPROM 64KBIT 400KHZ 8SOIC
Manufacturer
Atmel
Datasheet
1.AT24C32-10PC.pdf
(19 pages)
Specifications of AT24C64N-10SI-1.8
Format - Memory
EEPROMs - Serial
Memory Type
EEPROM
Memory Size
64K (8K x 8)
Speed
100kHz, 400kHz
Interface
I²C, 2-Wire Serial
Voltage - Supply
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
AT24C64N10SI1.8
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT24C64N-10SI-1.8
Manufacturer:
ATMEL/爱特梅尔
Quantity:
20 000
8A2 – TSSOP
18
Notes: 1. This drawing is for general information only. Refer to JEDEC Drawing MO-153, Variation AA, for proper dimensions, tolerances,
2. Dimension D does not include mold Flash, protrusions or gate burrs. Mold Flash, protrusions and gate burrs shall not exceed
3. Dimension E1 does not include inter-lead Flash or protrusions. Inter-lead Flash and protrusions shall not exceed 0.25 mm
4. Dimension b does not include Dambar protrusion. Allowable Dambar protrusion shall be 0.08 mm total in excess of the
5. Dimension D and E1 to be determined at Datum Plane H.
R
AT24C32/64
datums, etc.
0.15 mm (0.006 in) per side.
(0.010 in) per side.
b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. Minimum space between
protrusion and adjacent lead is 0.07 mm.
2325 Orchard Parkway
San Jose, CA 95131
Top View
Side View
Pin 1 indicator
3
this corner
D
b
2
e
1
N
A2
E1
A
TITLE
8A2, 8-lead, 4.4 mm Body, Plastic
Thin Shrink Small Outline Package (TSSOP)
E
SYMBOL
D
E
E1
A
A2
b
e
L
L1
End View
2.90
4.30
0.80
0.19
0.45
COMMON DIMENSIONS
MIN
(Unit of Measure = mm)
–
L
L1
6.40 BSC
0.65 BSC
1.00 REF
NOM
3.00
4.40
1.00
0.60
–
–
MAX
3.10
4.50
1.20
1.05
0.30
0.75
DRAWING NO.
NOTE
8A2
2, 5
3, 5
4
0336K–SEEPR–7/03
5/30/02
REV.
B