W25X16VSSIG Winbond Electronics, W25X16VSSIG Datasheet - Page 32

• Manufacturer Part Number: W25X16VSSIG
• Description: IC FLASH 16MBIT 75MHZ 8SOIC
• Manufacturer: Winbond Electronics

Specifications of W25X16VSSIG

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (2M x 8)
• Speed: 75MHz
• Interface: SPI Serial
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 8-SOIC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

W25X16, W25X32, W25X64
11.2.17 JEDEC ID (9Fh)
For compatibility reasons, the W25X16/32/64 provides several instructions to electronically determine
the identity of the device. The Read JEDEC ID instruction is compatible with the JEDEC standard for
SPI compatible serial memories that was adopted in 2003.
The instruction is initiated by driving the /CS pin low and shifting the instruction code “9Fh”. The
JEDEC assigned Manufacturer ID byte for Winbond (EFh) and two Device ID bytes, Memory Type
(ID15-ID8) and Capacity (ID7-ID0) are then shifted out on the falling edge of CLK with most significant
bit (MSB) first as shown in figure 19. For memory type and capacity values refer to Manufacturer and
Device Identification table.
Figure 19. Read JEDEC ID
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