W25X64VZEIG Winbond Electronics, W25X64VZEIG Datasheet - Page 44
W25X64VZEIG
Manufacturer Part Number
W25X64VZEIG
Description
IC FLASH 64MBIT 75MHZ 8WSON
Manufacturer
Winbond Electronics
Datasheet
1.W25X16AVDAIZ.pdf
(50 pages)
Specifications of W25X64VZEIG
Format - Memory
FLASH
Memory Type
FLASH
Memory Size
64M (8M x 8)
Speed
75MHz
Interface
SPI Serial
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Package / Case
8-WSON
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
- Current page: 44 of 50
- Download datasheet (2Mb)
8-Contact 6x5mm WSON Cont’d.
Notes:
1. Advanced Packaging Information; please contact Winbond for the latest minimum and maximum specifications.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E1 do not include mold flash protrusions and should be measured from the bottom of the
4. The metal pad area on the bottom center of the package is connected to the device ground (GND pin). Avoid
SOLDER PATTERN
package.
placement of exposed PCB vias under the pad.
SYMBOL
M
N
Q
R
P
MIN
MILLIMETERS
T
3.40
4.30
6.00
0.50
0.75
YP.
W25X16, W25X16A, W25X32, W25X64
MAX
- 44 -
MIN
INCHES
0.13 8
0.16 2
0.23 0
0.01 6
0.02 5
TYP.
3
9
6
9
5
MAX
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