XCF32PFSG48C Xilinx Inc, XCF32PFSG48C Datasheet

XCF32PFSG48C

Manufacturer Part Number

XCF32PFSG48C

Description

IC PROM SRL 1.8V 32M 48CSBGA

Manufacturer

Xilinx Inc

Datasheet

1.XCF01SVOG20C.pdf (35 pages)

Specifications of XCF32PFSG48C

Memory Size

32Mb

Programmable Type

In System Programmable

Voltage - Supply

1.65 V ~ 2 V

Operating Temperature

-40°C ~ 85°C

Package / Case

48-BFBGA, CSPBGA

Memory Type

Flash

Supply Voltage Range

1.65V To 2V

Memory Case Style

TFBGA

No. Of Pins

Operating Temperature Range

-40Â°C To +85Â°C

Termination Type

SMD

Filter Terminals

SMD

Rohs Compliant

Yes

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

122-1457

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XCN06024 (v1.0) January 1, 2007

Overview

The purpose of this notice is to inform Xilinx Platform Flash PROM users of a change in the composition of the solder balls

for the Pb-free 48TFBGA (FSG48) packages.

Description

This is a package assembly material change for the Platform Flash PROM sourced by ST Microelectronics. The SAC+

solder balls of the 48TFBGA (FSG48) packages will be replaced by SACN solder balls using existing processes and

in-process control methods. There will be no change in BGA pad metallurgy (CuOSP). The reasons for this change are:

•

SACN stands for Sn (Tin) - Ag (Silver) - Cu (Copper) - Ni (Nickel).

Ni is used as a dopant that concentrates in (Cu, Ni) 6Sn5 inter-metallic.

Products Affected

This change affects the following 48 FBGA Platform Flash devices:

Table 1: Platform Flash devices impacted by the SACN Solder Ball change

Key Dates

The estimated date code of first shipment of new SACN solder ball FSG48 product is WW19, 2007.

Response

The melting temperature is higher for the SACN FSG48 solder balls than the existing SAC balls. If you are using the Eutectic

Solder Reflow profile on Pb-free parts, the melting temperature of the SACN solder balls might require you to adjust the

solder profile higher (within JEDEC-20C). The melting range for the existing SAC+ alloy is 218°C to 222°C. The new melting

range for the SACN alloy is 220°C to 226°C. Both melting ranges fully meet the JEDEC-20C specification.

Solder ball composition change does not impact the FSG48 package structure reliability. For additional information or

questions, please contact

Important Notice: Xilinx Customer Notifications (PCN, PDN, and Quality Alerts) can be delivered via e-mail alerts sent by

the MySupport Web site (http://www.xilinx.com/support/mysupport.htm). Register today and personalize your “MyAlerts” to

include Customer Notifications. This change provides many benefits, including the ability to receive alerts for new and

updated information about specific products, as well as alerts for other publications such as data sheets, errata, application

notes, and so forth. For instructions on how to sign up, refer to

XCN06024 (v1.0) January 1, 2007

To offer Pb-free solder balls compliant with RoHS requirements: Without lead (Pb) and antimony (Sb).

The new SACN balls' metallurgy will increase the bonding strength of solder balls on BGA, reinforcing the inter-metallic

strength at the BGA side with more ductile balls than SAC+.

To provide better board level reliability.

Standardization to a common industry SACN metallurgy used in matrix BGA.

All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.

XCF08PFSG48C

XCF16PFSG48C

XCF32PFSG48C

Xilinx Technical

Platform Flash Devices

Support.

XCF08PFSG48C0973

XCF16PFSG48C0973

www.xilinx.com

Replacement of SAC+ Solder

Balls By SACN Solder Balls for

Platform Flash FBGA Devices

Xilinx Answer Record

18683.

Product/Process Change Notice

Related parts for XCF32PFSG48C

XCF32PFSG48C Summary of contents

Page 1

... Table 1: Platform Flash devices impacted by the SACN Solder Ball change Platform Flash Devices XCF08PFSG48C XCF16PFSG48C XCF32PFSG48C Key Dates The estimated date code of first shipment of new SACN solder ball FSG48 product is WW19, 2007. Response The melting temperature is higher for the SACN FSG48 solder balls than the existing SAC balls. If you are using the Eutectic Solder Reflow profile on Pb-free parts, the melting temperature of the SACN solder balls might require you to adjust the solder profile higher (within JEDEC-20C). The melting range for the existing SAC+ alloy is 218° ...

Page 2

Replacement of SAC+ Solder Balls By SACN Solder Balls for Platform Flash FBGA Devices Revision History The following table shows the revision history for this document. Date Version 01/01/07 1.0 Initial release. 2 Revision XCN06024 (v1.0) January 1, 2007 R ...

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