ISL6296ADRTZ-T Intersil, ISL6296ADRTZ-T Datasheet - Page 3

• Manufacturer Part Number: ISL6296ADRTZ-T
• Description: IC AUTHENTICATION DEVICE 8-TDFN
• Manufacturer: Intersil
• Series: FlexiHash™r

Specifications of ISL6296ADRTZ-T

• Function: Battery Authentication
• Battery Type: Li-Ion, Li-Pol, NiMH
• Voltage - Supply: 2.6 V ~ 4.8 V
• Operating Temperature: -25°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-TDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Electrical Specifications
Absolute Maximum Ratings
Supply Voltage (V
All Other Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to V
Recommended Operating Conditions
Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-25°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
DC CHARACTERISTICS
Supply Voltage
Run Mode Supply Current
(Exclude I/O Current)
Sleep Mode Supply Current
OTP Programming Mode Supply Current
Internal Regulated Supply Voltage
Internal OTP ROM Programming Voltage
POR Release Threshold
POR Assertion Threshold
XSD PIN CHARACTERISTICS
XSD Input Low Voltage
XSD Input High Voltage
XSD Input Hysteresis
XSD Internal Pull-Down Current
XSD Output Low Voltage
XSD Input Transition Time
XSD Output Fall Time
XSD Pin Capacitance
1. θ
2. θ
3. For θ
Tech Brief TB379.
JA
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
PARAMETER
DD
) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V
3
Unless otherwise noted, all parameters are established over the operational supply voltage and temperature
range of the device as follows: T
limits are 100% tested at +25°C, unless otherwise specified. Temperature limits established by characterization
and are not production tested.
(Reference to GND)
SYMBOL
V
V
V
I
I
C
V
V
V
POR+
V
I
DDS
DDP
POR-
V
I
V
HYS
DD
PD
t
t
PIN
DD
RG
PP
OL
X
F
IH
IL
During normal operation
During OTP ROM programming
V
V
V
For ~ 1.8ms duration per write operation
Observable only in test mode
Observable only in test mode
V
V
V
I
10% to 90% transition time
90% to 10%, C
OL
DD
DD
DD
DD
DD
DD
= 1mA
DD
= 4.2V
= 4.8V
= 4.2V, XSD pin floating
= 2.6V
= 4.2V
= 4.8V
+ 0.5V
ISL6296A
A
LOAD
= -25°C to +85°C; V
TEST CONDITIONS
= 12pF
Thermal Information
Thermal Resistance (Typical)
Maximum Junction Temperature (Plastic Package) . . . . . . . +125°C
Maximum Storage Temperature Range . . . . . . . . . .-40°C to +125°C
Pb-free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . .see link below
SOT-23 Package (Note 1) . . . . . . . . . .
2x3 TDFN Package (Notes 2, 3) . . . . .
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
DD
= 2.6V to 4.8V; Parameters with MIN and/or MAX
MIN
-0.4
2.6
2.8
2.3
1.9
1.5
1.5
11
-
-
-
-
-
-
-
-
-
-
-
-
TYP
0.15
400
250
2.5
2.2
1.8
0.8
1.2
1.8
38
40
12
6
θ
-
-
-
-
-
-
-
JA
200
(°C/W)
70
V
DD
MAX
500
4.8
4.8
0.5
2.7
2.4
2.1
0.5
2.0
2.5
0.4
55
65
13
50
+ 0.4V
2
-
-
-
θ
April 15, 2010
JC
10.5
N/A
FN6567.3
(°C/W)
UNITS
mV
µA
µA
µA
µA
µA
µA
µA
pF
µs
ns
V
V
V
V
V
V
V
V
V