LM3553SDX/NOPB National Semiconductor, LM3553SDX/NOPB Datasheet - Page 4

• Manufacturer Part Number: LM3553SDX/NOPB
• Description: IC LED DRIVER PHOTO FLASH 12-LLP
• Manufacturer: National Semiconductor
• Series: PowerWise®r
• Type: Photo Flash LED (I²C Interface)r

Specifications of LM3553SDX/NOPB

• Topology: Step-Up (Boost)
• Number Of Outputs: 1
• Internal Driver: Yes
• Type - Primary: Backlight, Flash/Torch
• Frequency: 1MHz ~ 1.35MHz
• Voltage - Supply: 2.7 V ~ 5.5 V
• Mounting Type: Surface Mount
• Package / Case: 12-LLP
• Operating Temperature: -30°C ~ 85°C
• Current - Output / Channel: 1.2A
• Internal Switch(s): Yes
• Efficiency: 90%
• For Use With: LM3553SDEV - BOARD EVALUATION FOR LM3553S
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Output: -
• Other names: LM3553SDX

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f
t
D
D
Th
Multi-Function Pin (M/F) Voltage Specifications
V
V
I
VIO
V
V
V
I
t
t
t
t
t
SW
FD-MIN
2
2
1
2
3
4
5
M/F
OL
C Compatible Voltage Specifications (SCL, SDIO, VIO)
IL
IH
OL
C Compatible Interface Timing Specifications (SCL, SDIO, VIO)
MAX
MIN
Symbol
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pin.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
T
Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note: AN-1187 for Recommended Soldering
Profiles.
Note 5: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7)
Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
Note 7: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists,
special care must be paid to thermal dissipation issues in board design.
TX,F-EN
J
=120ºC (typ.).
Switching Frequency
Minimum Flash Duration Step t
Maximum Duty Cycle
Minimum Duty Cycle
TX, F
Multi-Function Pin Threshold
Voltages
Output Logic Low "0"
Serial Bus Voltage Level
Input Logic Low "0"
Input Logic High "1"
Output Logic Low "0"
SCL (Clock Period)
Data In Setup Time to SCL
High
Data Out stable After SCL Low
SDA Low Setup Time to SCL
Low (Start)
SDA High Hold Time After SCL
High (Stop)
EN
A-MAX
Pin Threshold
Parameter
= T
J-MAX-OP
– (θ
JA
A-MAX
× P
D-MAX
D-MAX
) is dependent on the maximum operating junction temperature (T
), and the junction-to-ambient thermal resistance of the part/package in the application (θ
On
Off
Input Logic High "1"
Input Logic Low "0"
I
GPIO Mode
VIO = 3.0V
VIO = 3.0V
I
).
FD-MIN
LOAD
LOAD
= 4.2mA,
= 3.7mA
= 16 ÷ f
Conditions
SW
4
0.55 × VIO
0.94
1.45
Min
100
100
100
1.0
1.0
2.5
0
0
0
0
J-MAX-OP
12.8
Typ
1.2
92
6
J
=140ºC (typ.) and disengages at
= 125ºC), the maximum power
20171411
0.38 ×VIO
Max
1.35
0.64
VIO
VIN
VIN
400
VIN
400
0.6
JA
), as given by the
Units
µsec.
MHz
mV
mV
µs
ns
ns
ns
ns
%
%
V
V
V
V
V