HIP6601BCB Intersil, HIP6601BCB Datasheet
HIP6601BCB
Specifications of HIP6601BCB
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HIP6601BCB Summary of contents
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... CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. | 1-888-INTERSIL or 1-888-468-3774 Intersil (and design registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002-2005. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. FN9072.7 ...
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... SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD. HIP6604B QFN PACKAGE BOOT UGATE PHASE SHOOT- THROUGH PROTECTION LVCC LGATE PGND PAD PAD ON THE BOTTOM SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD HIP6601BCB, HIP6603BCB (SOIC) HIP6601ECB, HIP6603ECB (EPSOIC) TOP VIEW UGATE 1 8 PHASE BOOT 2 7 PVCC PWM 3 ...
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Typical Application: 3-Channel Converter Using HIP6301 and HIP6601B Gate Drivers +5V VFB COMP VCC PWM1 VSEN PWM2 PWM3 PGOOD MAIN CONTROL HIP6301 VID ISEN1 ISEN2 FS ISEN3 GND 3 HIP6601B, HIP6603B, HIP6604B +5V BOOT PVCC UGATE VCC PHASE DRIVE PWM ...
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Absolute Maximum Ratings Supply Voltage (VCC .15V Supply ...
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Functional Pin Description UGATE (Pin 1), (Pin 16 QFN) Upper gate drive output. Connect to gate of high-side power N-Channel MOSFET. BOOT (Pin 2), (Pin 2 QFN) Floating bootstrap supply pin for the upper gate drive. Connect a bootstrap capacitor ...
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A falling transition on PWM indicates the turn-off of the upper MOSFET and the turn-on of the lower MOSFET. A short propagation delay [ encountered before the PDLUGATE upper gate begins to fall [t ]. Again, the adaptive ...
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MOSFETs. The power dissipated by the driver is approximated as: 3 1.05f VCC ...
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Typical Performance Curves 1000 VCC = PVCC = 12V FREQUENCY 800 = 1MHz 600 FREQUENCY = 500kHz 400 FREQUENCY = 200kHz 200 0 1.0 2.0 3.0 GATE CAPACITANCE (C FIGURE 3. POWER DISSIPATION vs LOADING 400 VCC = 12V, PVCC ...
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Small Outline Exposed Pad Plastic Packages (EPSOIC) N INDEX 0.25(0.010) H AREA E - TOP VIEW SEATING PLANE - -C- α 0.10(0.004) 0.25(0.010 SIDE VIEW 1 ...
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... Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Features and dimensions A2, A3, D1, E1, P & θ are present when Anvil singulation method is used and not present for saw singulation ...
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... Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use ...