HIP6603BCB-T Intersil, HIP6603BCB-T Datasheet - Page 2

• Manufacturer Part Number: HIP6603BCB-T
• Description: IC DRIVER MOSFET SYNC BUCK 8SOIC
• Manufacturer: Intersil

Specifications of HIP6603BCB-T

• Configuration: High and Low Side, Synchronous
• Input Type: PWM
• Current - Peak: 400mA
• Number Of Configurations: 1
• Number Of Outputs: 2
• High Side Voltage - Max (bootstrap): 15V
• Voltage - Supply: 10.8 V ~ 13.2 V
• Operating Temperature: 0°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Delay Time: -

Ordering Information
Block Diagrams
HIP6601BCB
HIP6601BCB-T
HIP6601BECB
HIP6601BECB-T
HIP6603BCB
HIP6603BCB-T
HIP6603BECB
HIP6603BECB-T
HIP6604BCR
HIP6604BCR-T
PART NUMBER
PVCC
PWM
VCC
GND
PVCC
+5V
PWM
VCC
10K
10K
8 Ld SOIC Tape and Reel
8 Ld EPSOIC Tape and Reel
8 Ld SOIC Tape and Reel
8 Ld EPSOIC Tape and Reel
16 Ld 4x4 QFN Tape and Reel
TEMP. RANGE
+5V
CONTROL
LOGIC
10K
10K
0 to 85
0 to 85
0 to 85
0 to 85
0 to 85
(°C)
CONTROL
2
LOGIC
8 Ld SOIC
8 Ld EPSOIC
8 Ld SOIC
8 Ld EPSOIC
16 Ld 4x4 QFN L16.4x4
PACKAGE
PAD
PROTECTION
THROUGH
SHOOT-
HIP6601B, HIP6603B, HIP6604B
PAD ON THE BOTTOM SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD
PROTECTION
PAD
M8.15
M8.15B
M8.15
M8.15B
THROUGH
DWG. #
SHOOT-
PKG.
HIP6604B QFN PACKAGE
HIP6601B AND HIP6603B
FOR HIP6601ECB AND HIP6603ECB DEVICES, THE PAD ON THE BOTTOM
SIDE OF THE PACKAGE MUST BE SOLDERED TO THE PC BOARD.
†
Pinouts
BOOT
UGATE
PHASE
LVCC
LGATE
PGND
CONNECT LVCC TO VCC FOR HIP6601B CONFIGURATION
CONNECT LVCC TO PVCC FOR HIP6603B CONFIGURATION.
BOOT
UGATE
PHASE
LGATE
GND
BOOT
HIP6601ECB, HIP6603ECB (EPSOIC)
PWM
GND
HIP6601BCB, HIP6603BCB (SOIC)
UGATE
NC
BOOT
PWM
GND
1
2
3
4
1
2
3
4
16
HIP6604B (QFN)
†
5
VCC FOR HIP6601B
PVCC FOR HIP6603B
TOP VIEW
TOP VIEW
15
6
14
7
13
8
8
7
6
5
12
11
10
9
PHASE
PVCC
VCC
LGATE
NC
PVCC
LVCC
VCC
July 20, 2005
FN9072.7