L6235N STMicroelectronics, L6235N Datasheet - Page 19
![IC DRIVER 3PHASE MOTOR 24-PWRDIP](/photos/7/45/74572/l6235n_sml.jpg)
L6235N
Manufacturer Part Number
L6235N
Description
IC DRIVER 3PHASE MOTOR 24-PWRDIP
Manufacturer
STMicroelectronics
Type
Driverr
Datasheet
1.L6235D013TR.pdf
(25 pages)
Specifications of L6235N
Applications
DC Motor Driver, Brushless (BLDC), 3 Phase
Number Of Outputs
1
Current - Output
5.6A
Voltage - Supply
12 V ~ 52 V
Operating Temperature
-25°C ~ 125°C
Mounting Type
Through Hole
Package / Case
24-DIP (0.300", 7.62mm)
Operating Supply Voltage
7 V to 52 V
Supply Current
0.006 A
Mounting Style
Through Hole
Motor Type
Three Phase DC Brushless
No. Of Outputs
3
Output Current
7.1A
Output Voltage
52V
Supply Voltage Range
8V To 52V
Driver Case Style
DIP
No. Of Pins
24
Rohs Compliant
Yes
For Use With
497-4935 - BOARD MOTOR BRUSHLESS DC L6235
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Load
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-5353-5
L6235N
L6235N
OUTPUT CURRENT CAPABILITY AND IC POWER DISSIPATION
In Figure 22 is shown the approximate relation between the output current and the IC power dissipation using
PWM current control.
For a given output current the power dissipated by the IC can be easily evaluated, in order to establish which
package should be used and how large must be the on-board copper dissipating area to guarantee a safe op-
erating junction temperature (125°C maximum).
Figure 22. IC Power Dissipation versus Output Power.
THERMAL MANAGEMENT
In most applications the power dissipation in the IC is the main factor that sets the maximum current that can
be delivered by the device in a safe operating condition. Selecting the appropriate package and heatsinking con-
figuration for the application is required to maintain the IC within the allowed operating temperature range for
the application. Figures 23, 24 and 25 show the Junction-to-Ambient Thermal Resistance values for the
PowerSO36, PowerDIP24 and SO24 packages.
For instance, using a PowerSO package with copper slug soldered on a 1.5mm copper thickness FR4 board
with 6cm
mounting methods for this package. Using a multi-layer board with vias to a ground plane, thermal impedance
can be reduced down to 15°C/W.
Figure 23. PowerSO36 Junction-Ambient thermal resistance versus on-board copper area.
2
dissipating footprint (copper thickness of 35 m), the R
ºC / W
43
38
33
28
23
18
13
P
D
[W]
1
2
10
8
6
4
2
0
3
0
4
0.5
5
6
s q . c m
1
7
I
W ith o ut G ro u nd La yer
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
H o le s
OUT
8
1.5
[A]
9
10
2
1 1
1 2
2.5
13
3
Test Condition s:
Supply Voltage = 24 V
I
I
I
1
2
3
th(j-amb)
On-Board Copper Area
No PWM
f
SW
I
OUT
= 30 kHz (slow decay)
is about 35°C/W. Figure 26 shows
I
OUT
I
OUT
L6235
19/25