ISL6506CB Intersil, ISL6506CB Datasheet - Page 8
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ISL6506CB
Manufacturer Part Number
ISL6506CB
Description
IC MULTIPLE POWER CTRLR 8LEPSOIC
Manufacturer
Intersil
Datasheet
1.ISL6506BCBZ.pdf
(8 pages)
Specifications of ISL6506CB
Applications
Power Supply Controller/Monitor
Voltage - Supply
4.75 V ~ 5.25 V
Current - Supply
3.6mA
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Voltage - Input
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
ISL6506CB
Manufacturer:
Intersil
Quantity:
330
Part Number:
ISL6506CBZ
Manufacturer:
INTERSIL
Quantity:
20 000
Small Outline Exposed Pad Plastic Packages (EPSOIC)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
N
N
1
1
0.25(0.010)
2
2
-A-
TOP VIEW
SIDE VIEW
BOTTOM VIEW
INDEX
AREA
3
3
e
B
D
P
M
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
C A
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
SEATING PLANE
M
P1
For information regarding Intersil Corporation and its products, see www.intersil.com
-C-
E
-B-
B S
A
8
H
A1
α
0.25(0.010)
0.10(0.004)
ISL6506, ISL6506A, ISL6506B
M
L
h x 45°
B
M
C
M8.15C
8 LEAD NARROW BODY SMALL OUTLINE EXPOSED PAD
PLASTIC PACKAGE
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch
11. Dimensions “P” and “P1” are thermal and/or electrical enhanced
1. Symbols are defined in the “MO Series Symbol List” in Section
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
4. Dimension “E” does not include interlead flash or protrusions.
5. The chamfer on the body is optional. If it is not present, a visual
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
SYMBOL
2.2 of Publication Number 95.
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
Interlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
index feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
dimensions are not necessarily exact.
variations. Values shown are maximum size of exposed pad
within lead count and body size.
A1
P1
A
B
C
D
E
H
N
α
P
e
h
L
0.056
0.001
0.0138
0.0075
0.189
0.150
0.230
0.010
0.016
MIN
0°
-
-
0.050 BSC
INCHES
8
MAX
0.066
0.005
0.0192
0.0098
0.196
0.157
0.244
0.016
0.035
0.126
0.099
8°
1.43
0.03
0.35
0.19
4.80
3.811
5.84
0.25
0.41
MILLIMETERS
MIN
0°
-
-
1.27 BSC
8
MAX
1.68
0.13
0.49
0.25
4.98
3.99
6.20
0.41
0.89
3.200
2.514
8°
October 21, 2010
Rev. 1 6/05
NOTES
FN9141.4
11
11
9
3
4
5
6
7
-
-
-
-
-
-