TC72-5.0MUA Microchip Technology, TC72-5.0MUA Datasheet - Page 18

• Manufacturer Part Number: TC72-5.0MUA
• Description: SENSOR THERMAL SPI 5.0V 8MSOP
• Manufacturer: Microchip Technology

Specifications of TC72-5.0MUA

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Register Bank
• Sensor Type: Internal
• Sensing Temperature: -55°C ~ 125°C
• Output Type: SPI™
• Output Alarm: No
• Output Fan: No
• Voltage - Supply: 2.65 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Ic Output Type: Digital
• Sensing Accuracy Range: ± 2°C
• Supply Current: 400µA
• Supply Voltage Range: 2.65V To 5.5V
• Resolution (bits): 10bit
• Sensor Case Style: MSOP
• No. Of Pins: 8
• Full Temp Accuracy: 3 C
• Digital Output - Bus Interface: SPI
• Digital Output - Number Of Bits: 10 bit
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 2.6 V
• Description/function: High Accuracy 10-bit Serial Output, 4-Wire SPI Interface
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 55 C
• Temperature Sensing Range: -55°C To +125°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: TC72DM-PICTL - BOARD DEMO PICTAIL TC72
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

TC72
8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)
DS21743A-page 18
Z
Terminal Pitch
Terminal Land Pattern O.D.
Terminal Land Pattern I.D.
Exposed Pad Clearance
Interior Lead Clearance
Terminal Land Width
Terminal Land Length
Exposed Pad Length
Optional Exposed Pad Length
Exposed Pad Width
Termal Via Pitch
Thermal Via Diameter
Minimum Solder Mask Clearance
Drawing No. C04-2062
*Controlling Parameter
Notes:
1.
G
Exposed pad dimensions vary with paddle size.
CP
OPTIONAL TWO LAYER
DFN LAND PATTERN
PCB LAND PATTERN
X
Dimension Limits
H2
H
p
Units
CP
A1
H2
G2
P1
M
Z
Z
X
Y
H
V
p
G2
Y
MIN
.134
.057
.006
.071
.014
.033
.130
.130
.057
.002
M (TYP)
INCHES
.026 BSC
NOM
.047
.012
THERMAL VIAS
ON 4 LAYER
PC BOARD
MAX
TYPCAL SOLDER MASKS
.157
.060
.017
.035
.059
0V
OPTIONAL FOUR LAYER
P1
PCB LAND PATTERN
MIN
3.40
1.45
0.15
1.80
0.35
0.85
3.30
3.30
1.45
0.05
MILLIMETERS*
2002 Microchip Technology Inc.
0.65 BSC
NOM
1.20
0.30
MAX
4.00
1.53
0.42
0.88
1.50