ADT75ARZ Analog Devices Inc, ADT75ARZ Datasheet - Page 7

• Manufacturer Part Number: ADT75ARZ
• Description: IC SENSOR TEMP 12BIT DGTL 8SOIC
• Manufacturer: Analog Devices Inc

Specifications of ADT75ARZ

• Function: Temp Monitoring System (Sensor)
• Topology: ADC (Sigma Delta), Comparator, Register Bank
• Sensor Type: Internal
• Sensing Temperature: -55°C ~ 125°C
• Output Type: I²C™/SMBus™
• Output Alarm: No
• Output Fan: No
• Voltage - Supply: 3 V ~ 5.5 V
• Operating Temperature: -55°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Ic Output Type: Digital
• Sensing Accuracy Range: ± 2°C
• Supply Current: 200µA
• Supply Voltage Range: 3V To 5.5V
• Resolution (bits): 12bit
• Sensor Case Style: SOIC
• No. Of Pins: 8
• Msl: MSL 3 - 168 Hours
• Temperature Sensing Range: -55°C To +125°C
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
V
SDA Input Voltage to GND
SDA Output Voltage to GND
SCL Input Voltage to GND
OS/ALERT Output Voltage to GND
Operating Temperature Range
Storage Temperature Range
Maximum Junction Temperature, T
8-Lead MSOP (RM-8)
8-Lead SOIC (R-8)
IR Reflow Soldering
IR Reflow Soldering (Pb-Free Package)
1
2
3
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degrada-
tion or loss of functionality.
Values relate to package being used on a standard 2-layer PCB. This gives a
worst case θ
dissipation vs. ambient temperature (T
T
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a heat
sink. Junction-to-ambient resistance is more useful for air-cooled, PCB-
mounted components.
DD
A
Power Dissipation
Thermal Impedance
Power Dissipation
Thermal Impedance
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
Peak Temperature
Time at Peak Temperature
Ramp-Up Rate
Ramp-Down Rate
Time 25°C to Peak Temperature
= ambient temperature.
to GND
θ
θ
θ
θ
JA
JC
JA
JC
, Junction-to-Ambient (Still Air)
, Junction-to-Case
, Junction-to-Ambient (Still Air)
, Junction-to-Case
JA
and θ
JC
. Refer to Figure 3 for a plot of maximum power
1, 2
1, 2
3
3
A
).
JMAX
Rating
–0.3 V to +7 V
–0.3 V to V
–0.3 V to V
–0.3 V to V
–0.3 V to V
–55°C to +150°C
–65°C to +160°C
150.7°C
W
205.9°C/W
43.74°C/W
W
157°C/W
56°C/W
220°C (0°C/5°C)
10 sec to 20 sec
3°C/sec maximum
–6°C/sec maximum
6 minutes maximum
260°C (+0°C)
20 sec to 40 sec
3°C/sec maximum
–6°C/sec maximum
8 minutes maximum
MAX
MAX
= (T
= (T
JMAX
JMAX
DD
DD
DD
DD
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
− T
− T
A
A
)/θ
)/θ
Rev. A | Page 7 of 24
JA
JA
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 3. MSOP Maximum Power Dissipation vs. Ambient Temperature
1.2
1.0
0.8
0.6
0.4
0.2
0
TEMPERATURE (°C)
MAX PD = 3.4mW AT 150°C
ADT75