HIP6013CB-T Intersil, HIP6013CB-T Datasheet - Page 6

• Manufacturer Part Number: HIP6013CB-T
• Description: IC CONTROLLER PWM BUCK 14-SOIC
• Manufacturer: Intersil

Specifications of HIP6013CB-T

• Pwm Type: Voltage Mode
• Number Of Outputs: 1
• Frequency - Max: 1MHz
• Duty Cycle: 100%
• Voltage - Supply: 2.5 V ~ 12 V
• Buck: Yes
• Boost: No
• Flyback: No
• Inverting: No
• Doubler: No
• Divider: No
• Cuk: No
• Isolated: No
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Frequency-max: 1MHz
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

The over-current function will trip at a peak inductor current
(I
where I
- typical). The OC trip point varies mainly due to the
MOSFET’s r
in the normal operating load range, find the R
from the equation above with:
For an equation for the ripple current see the section under
component guidelines titled ‘Output Inductor Selection’.
A small ceramic capacitor should be placed in parallel with
R
presence of switching noise on the input voltage.
Application Guidelines
Layout Considerations
As in any high frequency switching converter, layout is very
important. Switching current from one power device to another
can generate voltage transients across the impedances of the
interconnecting bond wires and circuit traces. These
interconnecting impedances should be minimized by using
wide, short printed circuit traces. The critical components
should be located as close together as possible using ground
plane construction or single point grounding.
I
PEAK
1. The maximum r
2. The minimum I
3. Determine
PEAK
OCSET
where ∆I is the output inductor ripple current.
15A
10A
4V
2V
0V
5A
0A
) determined by:
=
OCSET
I
-------------------------------------------------- -
to smooth the voltage across R
OCSET
FIGURE 4. OVER-CURRENT OPERATION
DS(ON)
r
DS ON
is the internal OCSET current source (200µA
I
PEAK
•
(
R
DS(ON)
OCSET
OCSET
variations. To avoid over-current tripping
)
for I
PEAK
at the highest junction temperature.
from the specification table.
TIME (20ms/DIV)
6
>
I
OUT MAX
(
OCSET
)
+
OCSET
(
∆I
in the
) 2 ⁄
,
resistor
HIP6013
Figure 5 shows the critical power components of the
converter. To minimize the voltage overshoot the
interconnecting wires indicated by heavy lines should be part
of ground or power plane in a printed circuit board. The
components shown in Figure 6 should be located as close
together as possible. Please note that the capacitors C
and C
Locate the HIP6013 within 3 inches of the MOSFETs, Q1.
The circuit traces for the MOSFETs’ gate and source
connections from the HIP6013 must be sized to handle up to
1A peak current.
Figure 6 shows the circuit traces that require additional
layout consideration. Use single point and ground plane
construction for the circuits shown. Minimize any leakage
current paths on the SS PIN and locate the capacitor, C
close to the SS pin because the internal current source is
only 10µA. Provide local V
GND pins. Locate the capacitor, C
to the BOOT and PHASE pins.
FIGURE 5. PRINTED CIRCUIT BOARD
FIGURE 6. PRINTED CIRCUIT BOARD
C
SS
HIP6013
SS
O
each represent numerous physical capacitors.
HIP6013
UGATE
PHASE
GND
POWER AND GROUND PLANES OR ISLANDS
SMALL SIGNAL LAYOUT GUIDELINES
BOOT
C
PHASE
V
BOOT
CC
+12V
CC
Q1
V
RETURN
D2
C
IN
VCC
decoupling between VCC and
D1
BOOT
+V
C
as close as practical
IN
IN
Q1
D2
L
O
L
O
C
C
O
November 3, 2005
O
V
OUT
IN
V
ss
4325.1
OUT