EL7581IRE Intersil, EL7581IRE Datasheet - Page 9
![IC CONV DC/DC 3-CHAN 20-HTSSOP](/photos/28/16/281692/20-tssop_mdp_sml.jpg)
EL7581IRE
Manufacturer Part Number
EL7581IRE
Description
IC CONV DC/DC 3-CHAN 20-HTSSOP
Manufacturer
Intersil
Datasheet
1.EL7581IREZ.pdf
(17 pages)
Specifications of EL7581IRE
Applications
Converter, TFT, LCD
Voltage - Input
2.7 ~ 14 V
Number Of Outputs
2
Voltage - Output
5 ~ 17 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
EL7581IRE
Manufacturer:
ELANTEC
Quantity:
50 000
Company:
Part Number:
EL7581IRE-T13
Manufacturer:
VIA
Quantity:
17
Part Number:
EL7581IRE-T7
Manufacturer:
EL
Quantity:
20 000
Part Number:
EL7581IREZ
Manufacturer:
INTERSIL
Quantity:
20 000
Part Number:
EL7581IREZ-T13
Manufacturer:
INTERSIL
Quantity:
20 000
Typical Performance Curves
FIGURE 25. POWER-DOWN, 100K AND 0.1µF DELAY
FIGURE 29. 20-PIN HTSSOP THERMAL RESISTANCE vs PCB
FIGURE 27. LX WAVEFORM - DISCONTINUOUS MODE
C
SS
50
45
40
35
30
25
1
= 0.1µF
NETWORK ON ENP
AREA, NO AIR FLOW
2
V
V
I
OUT
10V/DIV
OUT
IN
5V/DIV
2V/DIV
20-PIN HTSSOP THERMAL PAD
SOLDERED TO 2-LAYER PCB WITH
0.039" THICKNESS AND 1-oz COPPER
ON BOTH SIDES
CONDITION:
= 3.3V
3
= 50mA
= 11.3V
200ms/DIV
PCB AREA (in
4
9
5
6
2
)
(Continued)
7
8
V
V
V
ON
OFF
BOOST
9
EL7581
FIGURE 26. POWER-UP, 100K AND 0.1µF DELAY NETWORK
FIGURE 30. PACKAGE POWER DISSIPATION vs AMBIENT
FIGURE 28. LX WAVEFORM - CONTINUOUS MODE
C
3.5
2.5
1.5
0.5
SS
5V/div
3
2
1
0
0
= 0.1µF
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY TEST BOARD
HTSSOP EXPOSED DIEPAD SOLDERED TO PCB
PER JESD51-5
2.857W
ON ENP
TEMPERATURE
25
V
V
I
OUT
IN
OUT
AMBIENT TEMPERATURE (°C)
= 3.3V
= 250mA
= 11.3V
50
1ms/DIV
75
85
10V/DIV
2V/DIV
100
125
V
V
V
BOOST
ON
OFF
150