MAX17510ATB+T Maxim Integrated Products, MAX17510ATB+T Datasheet - Page 12

• Manufacturer Part Number: MAX17510ATB+T
• Description: IC REG DDR LOW VOLTAGE 10-TDFN
• Manufacturer: Maxim Integrated Products

Specifications of MAX17510ATB+T

• Applications: Converter, DDR
• Voltage - Input: 1.1 ~ 3.6 V
• Number Of Outputs: 1
• Voltage - Output: 0.5 ~ 1.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 10-TDFN Exposed Pad
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

The MAX1510/MAX17510 operate with low-dropout
voltage and low quiescent current in notebook comput-
ers while maintaining good noise, transient response,
and AC rejection specifications. Improved supply-noise
rejection and transient response can be achieved by
increasing the values of the input and output capaci-
tors. Use passive filtering techniques when operating
from noisy sources.
The MAX1510/MAX17510 load-transient response
graphs (see the Typical Operating Characteristics ) show
two components of the output response: a DC shift from
the output impedance due to the load-current change
and the transient response. A typical transient response
for a step change in the load current from -1.5A to
+1.5A is 10mV. Increasing the output capacitor’s value
and decreasing the ESR attenuate the overshoot.
Low-Voltage DDR Linear Regulators
12
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Noise, PSRR, and Transient Response
The MAX1510/MAX17510 require proper layout to
achieve the intended output power level and low noise.
Proper layout involves the use of a ground plane,
appropriate component placement, and correct routing
of traces using appropriate trace widths. Refer to the
MAX1510 evaluation kit for a layout example:
• Minimize high-current ground loops. Connect the
• To optimize performance, a ground plane is essen-
• Connect the input filter capacitor less than 10mm
• Connect the backside pad to a large ground plane.
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in
the package code indicates RoHS status only. Package draw-
ings may show a different suffix character, but the drawing per-
tains to the package regardless of RoHS status.
PROCESS: BiCMOS
PACKAGE TYPE
ground of the device, the input capacitor, and the
output capacitor together at one point.
tial. Use all available copper layers in applications
where the device is located on a multilayer board.
from IN. The connecting copper trace carries large
currents and must be at least 2mm wide, preferably
5mm wide.
Use as much copper as necessary to decrease the
thermal resistance of the device. In general, more
copper provides better heatsinking capabilities.
10 TDFN-EP
PACKAGE CODE
Package Information
T1033+1
PCB Layout Guidelines
Chip Information
DOCUMENT NO.
21-0137