DPA423G Power Integrations, DPA423G Datasheet - Page 31
![IC CONV DC-DC DPA SWITCH 8SMD](/photos/7/32/73216/596-8-smd_sml.jpg)
DPA423G
Manufacturer Part Number
DPA423G
Description
IC CONV DC-DC DPA SWITCH 8SMD
Manufacturer
Power Integrations
Series
DPA-Switch®r
Specifications of DPA423G
Applications
Converter, Power Over Ethernet and Telecom Applications
Voltage - Input
16 ~ 75 V
Number Of Outputs
1
Voltage - Output
220V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SMD Gull Wing
For Use With
596-1195 - KIT REF DES DPA 6.6W DC-DC CONV596-1009 - KIT DESIGN ACCELERATOR DC-DC596-1007 - KIT DESIGN ACCELERATOR POE CONV
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DPA423GN
Manufacturer:
PowerInt
Quantity:
200
Company:
Part Number:
DPA423GN
Manufacturer:
POWER
Quantity:
5 000
Part Number:
DPA423GN
Manufacturer:
POWER
Quantity:
20 000
Company:
Part Number:
DPA423GN-TL
Manufacturer:
POWER
Quantity:
14 500
Company:
Part Number:
DPA423GN-TL
Manufacturer:
Power Integrations
Quantity:
88 094
Part Number:
DPA423GN-TL
Manufacturer:
POWER
Quantity:
20 000
www.powerint.com
Notes:
1. Package dimensions conform to JEDEC
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold flash
4. D, E and F are reference datums on the molded
-E-
DIM
B
J2
G08A
J1
M
A
B
C
G
H
K
N
Q
L
P
specification MS-001-AB for standard dual in-line
(DIP) package .300 inch row spacing
(PLASTIC) 8 leads (issue B, 7/85).
or other protrusions. Mold flash or
protrusions shall not exceed .006 (.15) on any
side.
body.
J3
0.240-0.260
0.367-0.387
0.125-0.145
0.015-0.040
0.120-0.140
0.057-0.068
0.014-0.022
0.008-0.015
0.030 (MIN)
0.300-0.320
0.300-0.390
0.100 BSC
0.300 BSC
1
inches
8
L
M
D S .004 (.10)
A
J1
0.76 (MIN)
2.54 BSC
7.62 BSC
9.32-9.83
6.10-6.60
3.18-3.68
0.38-1.02
3.05-3.56
1.45-1.73
0.36-0.56
0.20-0.38
7.62-8.13
7.62-9.91
mm
J2
5
4
.010 (.25) M A S
J4
C
P
-F-
-D-
G
a
L
1
8
G
Pin 1
M
Solder Pad Dimensions
D S .004 (.10)
SMD-8
DIP-8
.046 .060
.086
A
.004 (.10)
.186
J1
.286
J2
.060 .046
5
H
4
H
-E-
B
C
.080
K
.420
-F-
-D-
K
Notes:
1. Package dimensions conform to JEDEC
2. Controlling dimensions are inches.
3. Dimensions shown do not include mold
4. D, E and F are reference datums on the
DIM
J4
J1
J2
J3
M
A
B
C
G
H
K
P
specification MS-001-AB (issue B, 7/85)
except for lead shape and size.
flash or other protrusions. Mold flash
or protrusions shall not exceed .006 (.15)
on any side.
molded body.
L
a
0.240-0.260
0.367-0.387
0.125-0.145
0.004-0.012
0.036-0.044
0.057-0.068
0.048-0.053
0.032-0.037
0.007-0.011
0.010-0.012
0.372-0.388
0.030 (MIN)
0.100 BSC
DPA422-426
inches
0-8°
N
Q
P
0.76 (MIN)
2.54 BSC
9.32-9.83
6.10-6.60
3.18-3.68
0.10-0.30
0.91-1.12
1.45-1.73
1.22-1.35
0.81-0.94
0.18-0.28
0.25-0.30
9.45-9.86
mm
0-8°
PI-2076-101102
PI-2077-041003
P08A
Rev. S 12/07
31