ISL6556BCR-T Intersil, ISL6556BCR-T Datasheet - Page 7

• Manufacturer Part Number: ISL6556BCR-T
• Description: IC CTRLR MULTIPHASE VRM10 32-QFN
• Manufacturer: Intersil

Specifications of ISL6556BCR-T

• Applications: Controller, Intel VR10X
• Voltage - Input: 3 ~ 12 V
• Number Of Outputs: 4
• Voltage - Output: 0.84 ~ 1.6 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 32-VQFN Exposed Pad, 32-HVQFN, 32-SQFN, 32-DHVQFN
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+7V
Input, Output, or I/O Voltage (except OVP) . .GND -0.3V to V
OVP Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+15V
ESD (Human body model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>4kV
ESD (Machine model) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .>300V
ESD (Charged device model) . . . . . . . . . . . . . . . . . . . . . . . . . .>2kV
Operating Conditions
Supply Voltage, VCC (5V bias mode, Note 3) . . . . . . . . . . +5V ±5%
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 125°C
CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational section of this specification is not implied.
NOTES:
Electrical Specifications
VCC SUPPLY CURRENT
Nominal Supply
Shutdown Supply
SHUNT REGULATOR
VCC Voltage
VCC Sink Current
POWER-ON RESET AND ENABLE
POR Threshold
ENABLE Threshold
ENLL Input Logic Low Level
ENLL input Logic High Level
ENLL Leakage Current
REFERENCE VOLTAGE AND DAC
System Accuracy (VID = 1.2V-1.6V)
System Accuracy (VID = 0.8375V-1.1875V)
VID Pull Up
VID Input Low Level
VID Input High Level
DAC Source/Sink Current
OFSOUT Source/Sink Current
REF Source/Sink Current
1. θ
2. θ
3. For θ
Tech Brief TB379.
JA
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
PARAMETER
7
Operating Conditions: VCC = 5V or ICC < 25mA (Note 4), T
Unless Otherwise Specified.
VCC = 5VDC; EN = 5VDC; R
ISEN1 = ISEN2 = ISEN3 = ISEN4 = -70µA
VCC = 5VDC; EN = 0VDC; R
VCC tied to 12VDC thru 300Ω resistor, R
VCC tied to 12VDC thru 300Ω resistor, R
VCC Rising
VCC Falling
EN Rising
Hysteresis
Fault Reset
ENLL = 5V
(Note 5)
(Note 5)
VID = 010100
(ISL6556BCR Only)
CC
+ 0.3V
ISL6556B
TEST CONDITIONS
Thermal Information
Thermal Resistance
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
SOIC Package (Note 1) . . . . . . . . . . . .
QFN Package (Notes 2, 3) . . . . . . . . . .
(SOIC - Lead Tips Only)
T
T
= 100kΩ,
= 100kΩ
T
T
= 100kΩ
= 100kΩ
J
= 0°C to 105°C.
1.22
1.10
-200
MIN
-0.5
-0.8
5.6
4.2
3.7
0.8
-65
0.8
-50
-50
-
-
-
-
-
-
-
1.14
TYP
4.31
3.82
1.24
100
5.9
-50
14
10
θ
-
-
-
-
-
-
-
-
-
-
-
JA
(°C/W)
60
32
MAX
4.50
4.00
1.26
1.18
200
6.2
0.4
0.5
0.8
-35
0.4
18
14
25
50
50
1
-
-
-
December 28, 2004
θ
JC
UNITS
%VID
%VID
N/A
FN9097.4
3.5
mA
mA
mA
mV
(°C/W)
µA
µA
µA
µA
µA
V
V
V
V
V
V
V
V
V