MAX5073ETI+ Maxim Integrated Products, MAX5073ETI+ Datasheet - Page 4

• Manufacturer Part Number: MAX5073ETI+
• Description: IC CONV BUCK/BOOST 28-TQFN
• Manufacturer: Maxim Integrated Products
• Type: Step-Down (Buck), Step-Up (Boost)r

Specifications of MAX5073ETI+

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 2
• Voltage - Output: 0.8 ~ 28 V
• Current - Output: 1A, 2A
• Frequency - Switching: 200kHz ~ 2.2MHz
• Voltage - Input: 4.5 ~ 23 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 28-TQFN Exposed Pad
• Power - Output: 2.76W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

2.2MHz, Dual-Output Buck or Boost Converter
with Internal Power MOSFETs
ELECTRICAL CHARACTERISTICS (continued)
(V+ = VL = 5.2V or V+ = 5.5V to 23V, EN_ = VL, SYNC = GND, I
ic), R
4
Note 1: Specifications at -40°C are guaranteed by design and not production tested.
Note 2: Operating supply range (V+) is guaranteed by VL line regulation test. Connect V+ to VL for 5V operation.
Note 3: Output current may be limited by the power dissipation of the package, refer to the Power Dissipation section in the
INTERNAL OSCILLATOR/SYNC
Maximum Duty Cycle
Switching Frequency Range
Switching Frequency
Switching Frequency Accuracy
SYNC Frequency Range
SYNC High Threshold
SYNC Low Threshold
SYNC Input Min Pulse Width
Clock Output Phase Delay
SYNC to SOURCE1 Phase Delay
Clock Output High Level
Clock Output Low Level
EN_ INPUTS
EN_ Input High Threshold
EN_ Input Low Threshold
EN_ Bias Current
POWER-GOOD OUTPUT (PGOOD_)
PGOOD_ Threshold
PGOOD_ Output Voltage
P GO OD _ O utp ut Leakag e C ur r ent
THERMAL MANAGEMENT
Thermal Shutdown
Thermal Hysteresis
_______________________________________________________________________________________
OSC
Applications Information.
= 10kΩ (circuit of Figure 1), T
PARAMETER
SYNC
PGOOD VTH
V
I
V
SYMBOL
V
CLKOUT
LKP GOOD _
V
t
CLKOUTH
V
CLKOUTL
SYNCIN
PGOOD_
T
PHASE
T
D
f
I
A
SYNCH
SYNCL
SYNC
B(EN)
f
SHDN
f
V
HYST
V
SET
MAX
SW
= T
IH
PHASE
IL
J
= T
_
MIN
SYNC = SGND, f
SYNC = SGND, f
Each converter
R
5.6kΩ ≤ R
SYNC input frequency is twice the
individual converter frequency
R
2 / SOURCE2 waveform
R
VL = 5.2V, sourcing 5mA
VL = 5.2V, sinking 5mA
V+ = VL = 5.2V
V+ = VL = 5.2V
PGOOD goes high after V
PGOOD_ threshold
I
I
V+ = VL = 5.2V, V
Junction temperature
Junction temperature
SINK
SINK
OSC
OSC
OSC
to T
= 3mA (MAX5073ETI)
= 3mA (MAX5073ATI)
= 10kΩ, each converter
= 60kΩ, 1%, with respect to converter
= 60kΩ, 1%
MAX
OSC
, unless otherwise noted.) (Note 1)
≤ 56kΩ, 1% each converter
CONDITIONS
VL
SW
SW
PGOOD_
= 0mA, PGND = SGND, C
= 1.25MHz
= 2.2MHz
OUT
= 23V, V
crosses
FB_
= 1V
BYPASS
1125
MIN
200
400
-15
2.4
2.4
84
84
90
4
= 0.22µF, C
+150
1250
TYP
92.5
100
1.8
1.2
86
86
45
45
30
VL
MAX
2200
1375
4400
0.52
+15
250
0.8
0.4
0.8
0.4
95
95
95
= 4.7µF (ceram-
1
degrees
degrees
% V
UNITS
kHz
kHz
kHz
nA
µA
ns
°C
°C
%
%
V
V
V
V
V
V
V
OUT