LTC3459ES6#TRPBF Linear Technology, LTC3459ES6#TRPBF Datasheet - Page 11

• Manufacturer Part Number: LTC3459ES6#TRPBF
• Description: IC BOOST SYNC ADJ SOT23-6
• Manufacturer: Linear Technology
• Type: Step-Up (Boost)r

Specifications of LTC3459ES6#TRPBF

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 2.5 ~ 10 V
• Voltage - Input: 1.5 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: TSOT-23-6, TSOT-6
• Primary Input Voltage: 5.5V
• No. Of Outputs: 1
• Output Voltage: 10V
• Output Current: 75mA
• No. Of Pins: 6
• Operating Temperature Range: -40°C To +85°C
• Msl: MSL 1 - Unlimited
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output: -
• Power - Output: -
• Frequency - Switching: -

PACKAGE DESCRIPTION
3.55 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
2.15 ±0.05
3.85 MAX
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
0.20 BSC
1.65 ±0.05
(2 SIDES)
NOTE:
1. DIMENSIONS ARE IN MILLIMETERS
2. DRAWING NOT TO SCALE
3. DIMENSIONS ARE INCLUSIVE OF PLATING
2.62 REF
DATUM ‘A’
RECOMMENDED SOLDER PAD
RECOMMENDED SOLDER PAD LAYOUT
PITCH AND DIMENSIONS
0.62
MAX
PER IPC CALCULATOR
1.35 ±0.05
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
0.50 BSC
0.30 – 0.50 REF
0.95
REF
0.25 ± 0.05
0.70 ±0.05
PACKAGE
OUTLINE
1.22 REF
(SEE NOTE 6)
1.4 MIN
TOP MARK
PIN 1 BAR
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715)
(Reference LTC DWG # 05-08-1636)
4. DIMENSIONS ARE EXCLUSIVE OF MOLD FLASH AND METAL BURR
5. MOLD FLASH SHALL NOT EXCEED 0.254mm
6. JEDEC PACKAGE REFERENCE IS MO-193
0.200 REF
6-Lead Plastic TSOT-23
0.09 – 0.20
(NOTE 3)
DCB Package
S6 Package
2.00 ±0.10
(2 SIDES)
2.80 BSC
1.00 MAX
1.50 – 1.75
(NOTE 4)
0.75 ±0.05
0.80 – 0.90
3.00 ±0.10
(2 SIDES)
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.95 BSC
0.00 – 0.05
PIN ONE ID
1.65 ± 0.10
R = 0.05
(2 SIDES)
TYP
2.90 BSC
(NOTE 4)
R = 0.115
1.90 BSC
BOTTOM VIEW—EXPOSED PAD
TYP
1.35 ±0.10
(2 SIDES)
3
4
6
1
0.50 BSC
0.40 ± 0.10
S6 TSOT-23 0302 REV B
0.25 ± 0.05
0.01 – 0.10
0.30 – 0.45
6 PLCS (NOTE 3)
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
LTC3459
(DCB6) DFN 0405
11
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