LTC1735IS Linear Technology, LTC1735IS Datasheet - Page 31
![no-image](/images/manufacturer_photos/0/3/388/linear_technology_sml.jpg)
LTC1735IS
Manufacturer Part Number
LTC1735IS
Description
IC REG SW STEP-DOWN SYNC 16-SOIC
Manufacturer
Linear Technology
Type
Step-Down (Buck)r
Datasheet
1.LTC1735CSPBF.pdf
(32 pages)
Specifications of LTC1735IS
Internal Switch(s)
No
Synchronous Rectifier
Yes
Number Of Outputs
1
Voltage - Output
0.8 ~ 6 V
Current - Output
3A
Frequency - Switching
300kHz
Voltage - Input
4 ~ 30 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
16-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Power - Output
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LTC1735IS
Manufacturer:
Linear Technology
Quantity:
135
Part Number:
LTC1735IS
Manufacturer:
LT/凌特
Quantity:
20 000
Company:
Part Number:
LTC1735IS#PBF
Manufacturer:
LT
Quantity:
890
Part Number:
LTC1735IS-1
Manufacturer:
LINEAR/凌特
Quantity:
20 000
PACKAGE
(0.178 – 0.249)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
.007 – .0098
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
(.0036 – .0079)
0.09 – 0.20
(0.38 0.10)
.015 .004
(0.406 – 1.270)
(.169 – .177)
(MILLIMETERS)
.016 – .050
4.30 – 4.50**
(.018 – .030)
0.45 – 0.75
MILLIMETERS
INCHES
DESCRIPTION
(INCHES)
.030 .005
(0.203 – 0.254)
45
.008 – .010
TYP
.245
MIN
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
(0.254 – 0.508)
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
0 – 8 TYP
RECOMMENDED SOLDER PAD LAYOUT
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
.010 – .020
N
1
.050 BSC
(0.203 – 0.305)
**
*
(0.406 – 1.270)
.008 – .012
DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED .152mm (.006") PER SIDE
DIMENSIONS DO NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED .254mm (.010") PER SIDE
.016 – .050
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
2
0 – 8
(1.351 – 1.727)
.053 – .068
45
3
(.0256)
(MILLIMETERS)
0.65
BSC
INCHES
U
16-Lead Plastic Small Outline (Narrow .150 Inch)
(.0077 – .0118)
0.195 – 0.30
0 – 8 TYP
16-Lead Plastic SSOP (Narrow .150 Inch)
N/2
.045 .005
.160 .005
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
(Reference LTC DWG # 05-08-1641)
(Reference LTC DWG # 05-08-1610)
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1650)
(0.635)
.0250
BSC
(5.791 – 6.197)
(1.346 – 1.752)
(0.102 – 0.249)
.228 – .244
.004 – .0098
.053 – .069
GN Package
S Package
(0.355 – 0.483)
F Package
(.002 – .006)
0.05 – 0.15
.014 – .019
(5.817 – 6.198)
TYP
.229 – .244
(.0433)
MAX
1.10
16
N
1
20 19 18 17 16 15
1
15
2
16 15 14 13
1
2
3 4 5 6 7 8 9 10
2 3
14
(4.801 – 4.978)
3
(.252 – .260)
.189 – .196*
6.40 – 6.60*
(9.804 – 10.008)
4
.386 – .394
13
4
12 11 10 9
NOTE 3
5 6 7
14 13
(1.270)
.050
BSC
12
5
12
8
11
11
6
(3.810 – 3.988)
.150 – .157**
6.40
BSC
(0.229)
10
.009
7
REF
6.60 0.10
0.45 0.05
N/2
9
8
RECOMMENDED SOLDER PAD LAYOUT
.0165 .0015
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
NOTE 3
S16 0502
LTC1735
0.65 TYP
.045 .005
.150 – .165
4.50 0.10
1.05 0.10
F20 TSSOP 0502
GN16 (SSOP) 0502
31
.0250 TYP
1735fc