AD9267BCPZ Analog Devices Inc, AD9267BCPZ Datasheet - Page 7

• Manufacturer Part Number: AD9267BCPZ
• Description: IC MOD SIGMA-DELTA DUAL 64LFCSP
• Manufacturer: Analog Devices Inc

Specifications of AD9267BCPZ

• Applications: *
• Mounting Type: Surface Mount
• Package / Case: 64-LFCSP
• Resolution (bits): 16bit
• Sampling Rate: 640MSPS
• Input Channel Type: Differential
• Data Interface: Serial, SPI
• Supply Voltage Range - Analog: 1.7V To 1.9V
• Supply Voltage Range - Digital: 1.7V To 1.9V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Electrical
Environmental
AVDD to AGND
DVDD to DGND
DRVDD to DGND
AGND to DGND
AVDD to DRVDD
CVDD to CGND
CGND to DGND
D0±A to D3±A to DGND
D0±B to D3±B to DGND
DCO± to DGND
OR±A, OR±B to DGND
PDWNA to DGND
PDWNB to DGND
PLLMULTx to DGND
SDIO to DGND
CSB to AGND
SCLK to AGND
VIN±A, VIN±B to AGND
CLK+, CLK− to CGND
Storage Temperature Range
Operating Temperature Range
Junction Temperature
Lead Temperature (Soldering, 10 sec)
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +0.3 V
−3.9 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−0.3 V to +2.0 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +3.9 V
−0.3 V to +2.5 V
−0.3 V to +2.0 V
Rev. 0 | Page 7 of 24
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for
the LFCSP package. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the
thermal capability of the package.
Typical θ
Airflow increases heat dissipation, effectively reducing θ
addition, metal in direct contact with the package leads from
metal traces, through holes, ground, and power planes reduces
the θ
Table 6. Thermal Resistance
Package Type
64-Lead LFCSP (CP-64-4)
ESD CAUTION
JA
.
JA
and θ
JC
are specified for a 4-layer board in still air.
θ
22
JA
AD9267
Unit
°C/W
JA
. In