NBSG16MNG ON Semiconductor, NBSG16MNG Datasheet - Page 11

• Manufacturer Part Number: NBSG16MNG
• Description: IC RCVR/DRVR RSECL SIGE DF 16QFN
• Manufacturer: ON Semiconductor
• Type: Transceiverr

Specifications of NBSG16MNG

• Applications: Instrumentation
• Mounting Type: Surface Mount
• Package / Case: 16-TFQFN Exposed Pad
• Logic Family: NBSG
• Logic Type: Differential Receiver and Driver
• Supply Voltage (max): - 3.465 V, 3.465 V
• Supply Voltage (min): - 2.375 V, 2.375 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Data Rate: 12000 Mbps
• Minimum Operating Temperature: - 40 C
• Number Of Lines (input / Output): / /
• Supply Current: 29 mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: NBSG16MNGOS

LASER MARK FOR PIN 1
IDENTIFICATION IN
THIS AREA
−Y−
3 X
E
A
e
0.20
S
A2
−X−
ROTATED 90 CLOCKWISE
A1
VIEW M−M
4
DETAIL K
3
D
_
4
2
PLASTIC 4X4 (mm) BGA FLIP CHIP PACKAGE
1
A
B
C
D
0.10 Z
FEDUCIAL FOR PIN A1
IDENTIFICATION IN THIS AREA
16 X
16 X
PACKAGE DIMENSIONS
3
5
0.15 Z
b
http://onsemi.com
0.15
0.08
−Z−
CASE 489−01
BA SUFFIX
FCBGA−16
M
M
ISSUE O
K
Z
Z
11
X
M
M
Y
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
3. DIMENSION b IS MEASURED AT THE MAXIMUM
4. DATUM Z (SEATING PLANE) IS DEFINED BY THE
5. PARALLELISM MEASUREMENT SHALL EXCLUDE
PER ASME Y14.5M, 1994.
SOLDER BALL DIAMETER, PARALLEL TO DATUM
PLANE Z.
SPHERICAL CROWNS OF THE SOLDER BALLS.
ANY EFFECT OF MARK ON TOP SURFACE OF
PACKAGE.
DIM
A1
A2
A
b
D
E
e
S
MILLIMETERS
MIN
0.25
0.30
1.40 MAX
1.20 REF
4.00 BSC
4.00 BSC
1.00 BSC
0.50 BSC
MAX
0.35
0.50