HCPL-0600-500E Avago Technologies US Inc., HCPL-0600-500E Datasheet - Page 7
![OPTOCOUPLER LOG-OUT 10MBD 8-SOIC](/photos/7/65/76546/516-8-soic_sml.jpg)
HCPL-0600-500E
Manufacturer Part Number
HCPL-0600-500E
Description
OPTOCOUPLER LOG-OUT 10MBD 8-SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-0600-500E.pdf
(22 pages)
Specifications of HCPL-0600-500E
Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
50mA
Data Rate
10MBd
Propagation Delay High - Low @ If
50ns @ 7.5mA
Current - Dc Forward (if)
20mA
Input Type
DC
Output Type
Open Collector
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
0.01 us
Maximum Forward Diode Current
20 mA
Minimum Forward Diode Voltage
1.4 V
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
10 MBd(Typ)
Maximum Forward Diode Voltage
1.75 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
85 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1485-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-0600-500E
Manufacturer:
AVAGO
Quantity:
31 000
Company:
Part Number:
HCPL-0600-500E
Manufacturer:
AVAGO
Quantity:
20
Part Number:
HCPL-0600-500E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Part Number:
HCPL-0600-500E/HCPL0600
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Solder Reflow Temperature Profile
7
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300
(HCNW137, HCNW2601/11)
TEMPERATURE
ROOM
(0.071 ± 0.006)
1.80 ± 0.15
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
1
8
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
3
6
BSC
2.54
50
3 °C + 1 °C/–0.5 °C
4
5
(0.061)
MAX.
1.55
150 °C, 90 + 30 SEC.
PREHEATING TIME
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
MAX.
(0.030 ± 0.010)
2.5 C ± 0.5 °C/SEC.
0.75 ± 0.25
100
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
245 °C
TEMP.
PEAK
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
1.00 ± 0.15
12.30 ± 0.30
(0.433)
150
11.00
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
50 SEC.
7° NOM.
SOLDERING
200 °C
TIME
200
(0.534)
13.56
(0.010
0.254
PEAK
TEMP.
240 °C
- 0.0051
+ 0.003)
- 0.002)
+ 0.076
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250