HCPL-0600-500E Avago Technologies US Inc., HCPL-0600-500E Datasheet - Page 7

• Manufacturer Part Number: HCPL-0600-500E
• Description: OPTOCOUPLER LOG-OUT 10MBD 8-SOIC
• Manufacturer: Avago Technologies US Inc.

Specifications of HCPL-0600-500E

• Package / Case: 8-SOIC (0.154", 3.90mm Width)
• Voltage - Isolation: 3750Vrms
• Number Of Channels: 1, Unidirectional
• Current - Output / Channel: 50mA
• Data Rate: 10MBd
• Propagation Delay High - Low @ If: 50ns @ 7.5mA
• Current - Dc Forward (if): 20mA
• Input Type: DC
• Output Type: Open Collector
• Mounting Type: Surface Mount
• Isolation Voltage: 3750 Vrms
• Maximum Continuous Output Current: 50 mA
• Maximum Fall Time: 0.01 us
• Maximum Forward Diode Current: 20 mA
• Minimum Forward Diode Voltage: 1.4 V
• Output Device: Logic Gate Photo IC
• Configuration: 1 Channel
• Maximum Baud Rate: 10 MBd(Typ)
• Maximum Forward Diode Voltage: 1.75 V
• Maximum Reverse Diode Voltage: 5 V
• Maximum Power Dissipation: 85 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 516-1485-2

Solder Reflow Temperature Profile
7
8-Pin Widebody DIP Package with Gull Wing Surface Mount Option 300
(HCNW137, HCNW2601/11)
TEMPERATURE
ROOM
(0.071 ± 0.006)
1.80 ± 0.15
300
200
100
0
0
NOTE: NON-HALIDE FLUX SHOULD BE USED.
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
PREHEATING RATE 3 °C + 1 °C/–0.5 °C/SEC.
REFLOW HEATING RATE 2.5 °C ± 0.5 °C/SEC.
160 °C
150 °C
140 °C
1
8
(0.442 ± 0.006)
11.23 ± 0.15
7
2
(0.100)
3
6
BSC
2.54
50
3 °C + 1 °C/–0.5 °C
4
5
(0.061)
MAX.
1.55
150 °C, 90 + 30 SEC.
PREHEATING TIME
(0.354 ± 0.006)
(0.158)
9.00 ± 0.15
4.00
MAX.
(0.030 ± 0.010)
2.5 C ± 0.5 °C/SEC.
0.75 ± 0.25
100
TIME (SECONDS)
LAND PATTERN RECOMMENDATION
245 °C
TEMP.
PEAK
(0.051)
1.3
(0.039 ± 0.006)
(0.484 ± 0.012)
1.00 ± 0.15
12.30 ± 0.30
(0.433)
150
11.00
MAX.
SEC.
30
SEC.
30
(0.09)
2.29
50 SEC.
7° NOM.
SOLDERING
200 °C
TIME
200
(0.534)
13.56
(0.010
0.254
PEAK
TEMP.
240 °C
- 0.0051
+ 0.003)
- 0.002)
+ 0.076
TIGHT
TYPICAL
LOOSE
230 °C
TEMP.
PEAK
250