HCPL-2200-000E Avago Technologies US Inc., HCPL-2200-000E Datasheet - Page 7
![OPTOCOUPLER LOGIC 2.5MBD 8-DIP](/photos/7/66/76618/516-8-dip_sml.jpg)
HCPL-2200-000E
Manufacturer Part Number
HCPL-2200-000E
Description
OPTOCOUPLER LOGIC 2.5MBD 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HCPL-2200-500E.pdf
(13 pages)
Specifications of HCPL-2200-000E
Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
25mA
Data Rate
2.5MBd
Propagation Delay High - Low @ If
210ns @ 3mA
Current - Dc Forward (if)
10mA
Input Type
DC
Output Type
Tri-State
Mounting Type
Through Hole
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
25 mA
Maximum Fall Time
0.007 us
Maximum Forward Diode Current
10 mA
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
5 MBd(Typ)
Maximum Forward Diode Voltage
1.7 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
210 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
No. Of Channels
1
Optocoupler Output Type
Logic Gate
Input Current
5mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Common Mode Ratio
2.5k
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1647-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-2200-000E
Manufacturer:
AVAGO
Quantity:
5 000
Part Number:
HCPL-2200-000E
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Recommended Operating Conditions
*The initial switching threshold is 1.6 mA or less. It is recommended that 2.2 mA be used to permit
at least a 20% CTR degradation guardband.
Absolute Maximum Ratings
(No Derating Required up to 70 C)
7
Parameter
Power Supply Voltage
Enable Voltage High
Enable Voltage Low
Forward Input Current
Forward Input Current
Operating Temperature
Fan Out
Parameter
Storage Temperature
Operating Temperature
Average Forward Input Current
Peak Transient Input Current
( 1 s Pulse Width, 300 pps)
Reverse Input Voltage
Average Output Current
Supply Voltage
Three State Enable Voltage
Output Voltage
Total Package Power Dissipation
Lead Solder Temperature
Solder Reflow Temperature Profile
Symbol
I
I
F(OFF)
F(ON)
V
V
V
T
N
CC
EH
EL
A
Min.
1.6*
4.5
2.0
0
–
0
Symbol
I
I
F(TRAN)
F(AVG)
V
T
T
V
V
V
P
I
CC
260 C for 10 sec., 1.6 mm below seating plane
O
A
R
O
S
E
T
Max.
85
See Package Outline Drawings section
0.8
0.1
20
20
5
4
[1]
TTL Loads
Min.
-0.5
-0.5
-55
-40
Units
0
mA
mA
V
V
V
C
Max.
125
210
1.0
85
10
25
20
20
20
5
Units
mW
mA
mA
A
V
V
V
V
C
C
Note
1
1