HCPL-3180-000E Avago Technologies US Inc., HCPL-3180-000E Datasheet - Page 3

OPTOCOUPLER 2.0A 250KHZ 8-DIP

HCPL-3180-000E

Manufacturer Part Number
HCPL-3180-000E
Description
OPTOCOUPLER 2.0A 250KHZ 8-DIP
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-3180-000E

Package / Case
8-DIP (0.300", 7.62mm)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
2.5A
Propagation Delay High - Low @ If
150ns @ 10mA
Current - Dc Forward (if)
16mA
Input Type
DC
Output Type
Gate Driver
Mounting Type
Through Hole
Isolation Voltage
3750 Vrms
Maximum Fall Time
0.025 us
Maximum Forward Diode Current
25 mA
Minimum Forward Diode Voltage
1.2 V
Output Device
Integrated Photo IC
Configuration
1 Channel
Maximum Forward Diode Voltage
1.8 V
Maximum Reverse Diode Voltage
5 V
Maximum Power Dissipation
295 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 40 C
Number Of Elements
1
Forward Voltage
1.8V
Forward Current
25mA
Package Type
PDIP
Operating Temp Range
-40C to 100C
Power Dissipation
295mW
Propagation Delay Time
200ns
Pin Count
8
Mounting
Through Hole
Reverse Breakdown Voltage
5V
Operating Temperature Classification
Industrial
No. Of Channels
1
Optocoupler Output Type
Gate Drive
Input Current
16mA
Output Voltage
20V
Opto Case Style
DIP
No. Of Pins
8
Common Mode Ratio
10 KV/uS
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1674-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Bonase Electronics (HK) Co., Limited Bonase Electronics (HK) Co., Limited
Part Number:
HCPL-3180-000E
Manufacturer:
AVAGO
Quantity:
6 236
Price:
Solder Reflow Temperature Profile
3
HCPL-3180 Gull Wing Surface Mount Option 300
TEMPERATURE
ROOM
(0.043 ± 0.013)
1.080 ± 0.320
300
200
100
0
Note: Non-halide flux should be used.
0
(0.047)
MAX.
1.19
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
NOTE: FLOATING LEAD PROTRUSION IS 0.25 mm (10 mils) MAX.
1
8
(0.100)
2.54
BSC
(0.380 ± 0.010)
50
9.65 ± 0.25
7
2
3°C + 1°C/–0.5°C
150°C, 90 + 30 SEC.
PREHEATING TIME
6
3
2.5°C ± 0.5°C/SEC.
4
5
(0.070)
MAX.
100
1.780
TIME (SECONDS)
(0.140 ± 0.005)
(0.250 ± 0.010)
6.350 ± 0.25
3.56 ± 0.13
TEMP.
PEAK
245°C
(0.025 ± 0.005)
0.635 ± 0.130
150
LAND PATTERN RECOMMENDATION
SEC.
SEC.
30
30
1.27 (0.050)
50 SEC.
SOLDERING
(0.380 ± 0.010)
(0.300 ± 0.010)
(0.025 ± 0.010)
0.635 ± 0.25
9.65 ± 0.25
1.016 (0.040)
7.62 ± 0.25
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
12° NOM.
10.9 (0.430)
2.0 (0.080)
(0.010
0.254
+ 0.003)
- 0.002)
+ 0.076
- 0.051

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