ACPL-072L-500E Avago Technologies US Inc., ACPL-072L-500E Datasheet - Page 5

OPTOCOUPLER 3.3/5V 25MBD 8-SOIC

ACPL-072L-500E

Manufacturer Part Number
ACPL-072L-500E
Description
OPTOCOUPLER 3.3/5V 25MBD 8-SOIC
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of ACPL-072L-500E

Package / Case
8-SOIC (0.154", 3.90mm Width)
Voltage - Isolation
3750Vrms
Number Of Channels
1, Unidirectional
Current - Output / Channel
10mA
Data Rate
25MBd
Propagation Delay High - Low @ If
23.5ns
Input Type
Logic
Output Type
Push-Pull, Totem-Pole
Mounting Type
Surface Mount
Maximum Fall Time
8 ns
Maximum Rise Time
9 ns
Output Device
Logic Gate Photo IC
Configuration
1 Channel
Maximum Baud Rate
25 MBps
Maximum Power Dissipation
150 mW
Maximum Operating Temperature
+ 105 C
Minimum Operating Temperature
- 40 C
Number Of Elements
1
Baud Rate
25Mbps
Output Current
10mA
Isolation Voltage
3750Vrms
Package Type
SOIC
Operating Temp Range
-40C to 105C
Power Dissipation
150mW
Propagation Delay Time
40ns
Pin Count
8
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ACPL-072L-500E
Manufacturer:
AD
Quantity:
450
Part Number:
ACPL-072L-500E
Manufacturer:
AVAGO
Quantity:
15 000
Solder Reflow Temperature Profile
TEMPERATURE
Note: Non-halide flux should be used
Recommended Pb-Free IR Profile
Note: Non-halide flux should be used
Regulatory Information
Both ACPL-072L and ACPL-772L are approved by the following organizations:
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(option 060 only)
5
NO TES:
THE TIME FROM 25
T
T
T
smax
ROOM
smax
smin
T
T
25
p
L
= 200
217
150 - 200
300
200
100
˚
0
˚
C, T
0
C
t 25
˚
smin
160 ˚C
150 ˚C
140 ˚C
˚
60 to 180 SEC.
C to PEAK TEMPERATURE = 8 MINUTES MAX.
3
C
PREHEATING RATE 3˚C + 1 ˚C/- 0.5 ˚C/SEC.
REFLOW HEATING RATE 2.5˚C ± 0.5 ˚C/SEC.
˚
PREHEAT
C/SEC. MAX.
˚
C to PEAK
= 150
RAMP-UP
t
s
260 +0/-5
˚
C
50
TIME
3˚C + 1 ˚C/- 0.5 ˚C
˚
C
PREHEATING TIME
150 ˚C, 90 + 30 SEC.
t
t
L
p
2.5˚ C ± 0.5˚C/SEC.
100
TIME WITHIN 5
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TIME (SECONDS)
RAMP-DOWN
6
˚
C/SEC. MAX.
TEMP.
PEAK
245 ˚C
˚
C of ACTUAL
150
SEC.
UL
Approved under UL 1577, component recognition
program up, File E55361.
CSA
Approved under CSA Component Acceptance Notice #5,
File CA 88324.
SEC.
30
30
50 SEC.
SOLDERING
TIME
200˚C
200
PEAK
TEMP.
240 ˚C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230˚C
250

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