HCPL-2602#300 Avago Technologies US Inc., HCPL-2602#300 Datasheet - Page 5
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HCPL-2602#300
Manufacturer Part Number
HCPL-2602#300
Description
OPTOCOUPLER LINE RX 8-SMD GW
Manufacturer
Avago Technologies US Inc.
Type
Line Receiverr
Datasheet
1.HCPL-2612-000E.pdf
(16 pages)
Specifications of HCPL-2602#300
Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Input Type
AC, DC
Voltage - Supply
4.5 V ~ 5.5 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Surface Mount
Isolation Voltage
3750 Vrms
Maximum Continuous Output Current
50 mA
Maximum Fall Time
10 ns
Maximum Forward Diode Current
60 mA
Maximum Rise Time
24 ns
Output Device
Integrated Photo IC
Configuration
1 Channel
Maximum Baud Rate
10 MBps
Maximum Forward Diode Voltage
2.7 V
Maximum Reverse Diode Voltage
0.95 V
Maximum Power Dissipation
40 mW
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Number Of Elements
1
Output Type
Open Collector
Baud Rate
10Mbps
Forward Voltage
2.7V
Forward Current
60mA
Output Current
50mA
Package Type
PDIP SMD
Operating Temp Range
0C to 70C
Power Dissipation
40mW
Propagation Delay Time
75ns
Pin Count
8
Mounting
Surface Mount
Reverse Breakdown Voltage
0.95V
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Solder Reflow Thermal Profile
TEMPERATURE
Recommended Pb-Free IR Profile
Insulation and Safety Related Specifications
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
5
Parameter
Min. External Air Gap
(External Clearance)
Min. External Tracking
Path (External Creepage)
Min. Internal Plastic
Gap (Internal Clearance)
Tracking Resistance
(Comparative Tracking
Index)
Isolation Group
ROOM
NOTES:
THE TIME FROM 25 °C to PEAK TEMPERATURE = 8 MINUTES MAX.
T
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200 °C, T
0
Note: Non-halide flux should be used.
150 - 200 °C
Note: Non-halide flux should be used.
217 °C
PREHEATING RATE 3°C + 1°C/–0.5°C/SEC.
REFLOW HEATING RATE 2.5°C ± 0.5°C/SEC.
160°C
150°C
140°C
t 25 °C to PEAK
3 °C/SEC. MAX.
60 to 180 SEC.
smin
PREHEAT
RAMP-UP
= 150 °C
50
t
s
3°C + 1°C/–0.5°C
260 +0/-5 °C
150°C, 90 + 30 SEC.
PREHEATING TIME
Symbol
TIME
L(I01)
L(I02)
CTI
2.5°C ± 0.5°C/SEC.
100
TIME (SECONDS)
t
t
L
p
Value
0.08
200
IIIa
7.1
7.4
TIME WITHIN 5 °C of ACTUAL
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
TEMP.
PEAK
245°C
RAMP-DOWN
6 °C/SEC. MAX.
150
Units
mm
mm
mm
V
SEC.
SEC.
30
30
50 SEC.
Conditions
Measured from input terminals to output terminals,
shortest distance through air.
Measured from input terminals to output terminals,
shortest distance path along body.
Through insulation distance, conductor to conductor,
usually the direct distance between the photoemitter
and photodetector inside the optocoupler cavity.
DIN IEC 112/VDE 0303 Part 1
Material Group (DIN VDE 0110, 1/89, Table 1)
SOLDERING
200°C
TIME
200
PEAK
TEMP.
240°C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230°C
250
Regulatory Information
The HCPL-2602/2612 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition Program,
File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.