HMA2701AR1V Fairchild Optoelectronics Group, HMA2701AR1V Datasheet
HMA2701AR1V
Specifications of HMA2701AR1V
Related parts for HMA2701AR1V
HMA2701AR1V Summary of contents
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HMA121 Series DESCRIPTION The HMA124, HMA121 series and HMA2701 series consists of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a compact 4-pin mini-flat package. The lead pitch is 2.54 mm. The HMAA2705 consists of two gallium ...
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HMA121 Series ABSOLUTE MAXIMUM RATINGS Parameter TOTAL PACKAGE Storage Temperature Operating Temperature EMITTER Continuous Forward Current Peak Forward Current (1 µs pulse, 300 pps.) Reverse Input Voltage (HMA) Power Dissipation Derate linearly (above 25°C) DETECTOR Continuous Collector Current Power Dissipation ...
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HMA121 Series ELECTRICAL CHARACTERISTICS INDIVIDUAL COMPONENT CHARACTERISTICS Parameter EMITTER Forward Voltage Reverse Current DETECTOR Breakdown Voltage Collector to Emitter (I Emitter to Collector (V Collector Dark Current (V Capacitance CE © 2003 Fairchild Semiconductor Corporation FULL PITCH MINI-FLAT PACKAGE HMA124 ...
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HMA121 Series TRANSFER CHARACTERISTICS Characteristic (I = ± Current Transfer Ratio ( ...
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HMA121 Series TYPICAL PERFORMANCE CURVES Fig. 1 Forward Current vs. Forward Voltage 100 T = 25˚ 0.6 0.8 1 FORWARD VOLTAGE (V) F Fig. 3 Current Transfer Ratio vs. Forward Current ...
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HMA121 Series Fig. 6 Collector Current vs. Collector-Emitter Voltage 25˚ 0 0.0 0.2 0 COLLECTOR-EMITTER VOLTAGE (V) CE Fig. 8 Switching Time vs. Load Resistance 1000 ...
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HMA121 Series ORDERING INFORMATION Option R1V R2V R3V R4V MARKING INFORMATION Definitions © 2003 Fairchild Semiconductor Corporation FULL PITCH MINI-FLAT PACKAGE HMA124 HMA2701 Series Tape and Reel (500 units; ...
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HMA121 Series Tape Width Tape Thickness Sprocket Hole Pitch Sprocket Hole Dia. Sprocket Hole Location Pocket Location Pocket Pitch Pocket Dimension Pocket Hole Dia. Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt Devices ...
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HMA121 Series Recommended Infrared Reflow Soldering Profile • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended © 2003 Fairchild Semiconductor ...
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HMA121 Series DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT ...