FODM3011R1 Fairchild Optoelectronics Group, FODM3011R1 Datasheet
![OPTOCOUPLER 250V TRIAC OUT 4MFP](/photos/7/72/77274/46-4-mfp_sml.jpg)
FODM3011R1
Specifications of FODM3011R1
FODM3011R1FS
FODM3011R1_NL
FODM3011R1_NL
Related parts for FODM3011R1
FODM3011R1 Summary of contents
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FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 4-Pin Full Pitch Mini-Flat Package Random-Phase Triac Driver Output Optocouplers Features ■ Compact 4-pin surface mount package (2.4 mm maximum standoff height) ■ Peak blocking voltage 250V (FODM301X) 400V (FODM302X) ■ Available in tape ...
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Absolute Maximum Ratings Parameter TOTAL PACKAGE Storage Temperature Junction Temperature Operating Temperature EMITTER Continuous Forward Current Peak Forward Current (1 µs pulse, 300 pps.) Reverse Input Voltage Power Dissipation (No derating required over operating temp. range) DETECTOR On-State RMS Current ...
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Typical Performance Curves Fig. 1 LED Forward Voltage vs. Forward Current 1.8 1.7 1.6 1.5 1 -40°C 1.3 1 25°C 1 100°C 1.0 0 FORWARD CURRENT ...
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Typical Performance Curves Fig. 5 LED Current Required to Trigger vs. LED Pulse Width 25° NORMALIZED LED TRIGGER PULSE WIDTH (°C) ...
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Typical Performance Curves 400V (FODM302X) 250V (FODM301X) R Vdc TEST PULSE INPUT MERCURY WETTED RELAY APPLIED VOLTAGE WAVEFORM 252 V (FODM302X) 158 V (FODM301X) 0 VOLTS τ RC NOTE: This optoisolator should not be used to drive a load directly. ...
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Figure 11. Inductive Load with Sensitive Gate Triac ( this circuit the “hot” side of the line is switched and the load connected to the cold or ...
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Ordering Information Option R1V R2V R3V R4V Marking Information Definitions FODM3010, FODM3011, FODM3012, FODM3021, FODM3022, FODM3023 Rev. 1.0.0 Tape and Reel (500 units) Tape and Reel (2500 units) Tape ...
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Tape Width Tape Thickness Sprocket Hole Pitch Sprocket Hole Dia. Sprocket Hole Location Pocket Location Pocket Pitch Pocket Dimension Pocket Hole Dia. Cover Tape Width Cover Tape Thickness Max. Component Rotation or Tilt Devices Per ...
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Footprint Drawing for PCB Layout Recommended Infrared Reflow Soldering Profile • Peak reflow temperature: 230°C (package surface temperature) for 30 seconds • Time of temperature higher than 210°C: 60 seconds or less • One time soldering reflow is recommended FODM3010, ...
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The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended exhaustive list of all such trademarks. FAST ACEx™ ActiveArray™ FASTr™ Bottomless™ FPS™ Build it Now™ FRFET™ CoolFET™ ...