HDSP2115S OSRAM Opto Semiconductors Inc, HDSP2115S Datasheet - Page 14

• Manufacturer Part Number: HDSP2115S
• Description: DISPLAY 8CHAR .200" ORANGE
• Manufacturer: OSRAM Opto Semiconductors Inc
• Series: Intelligent Display®r

Specifications of HDSP2115S

• Millicandela Rating: 150µcd
• Size / Dimension: 1.70" L x 0.77" W x 0.21" H (42.67mm x 19.58mm x 5.31mm)
• Color: Orange
• Configuration: 5 x 7
• Number Of Digits: 8
• Character Size: 0.2 in
• Illumination Color: Soft Orange
• Wavelength: 610 nm
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Luminous Intensity: 270 ucd
• Viewing Area (w X H): 2.85 mm x 4.81 mm
• Display Type: 5 x 7 Dot Matrix
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Voltage - Forward (vf) Typ: -
• Internal Connection: -
• Lead Free Status / Rohs Status: Details
• Other names: Q68000A8907

Displaying User Defined Character Example
Load character “A” into UDC-5 and then display it in digit 2
Logic levels: 0=Low, 1=High, X=Don‘t care
RST
0
1
1
1
1
1
1
1
1
1
Electrical and Mechanical Considerations
Voltage Transient Suppression
For best results power the display and the components that inter-
face with the display to avoid logic inputs higher than V
tionally, the LEDs may cause transients in the power supply line
while they change display states. The common practice is to place
a parallel combination of a 0.01 µF and a 22 µF capacitor between
V
ESD Protection
The input protection structure of the HDSP211XS provides signifi-
cant protection against ESD damage. It is capable of withstanding
discharges greater than 2.0 kV. Take all the standard precautions,
normal for CMOS components. These include properly grounding
personnel, tools, tables, and transport carriers that come in con-
tact with unshielded parts. If these conditions are not, or cannot be
met, keep the leads of the device shorted together or the parts in
antistatic packaging.
Soldering Considerations
The HDSP211XS can be hand soldered with SN63 solder using a
grounded iron set to 260°C.
Wave soldering is also possible following these conditions:
Preheat that does not exceed 93°C on the solder side of the PC
board or a package surface temperature of 85°C. Water soluble
organic acid flux (except carboxylic acid) or rosin-based RMA flux
without alcohol can be used.
Direct contact with alcohol or alcohol vapor will cause degradation
of the package.
Wave temperature of 245°C ±5°C with a dwell between 1.5 sec.
to 3.0 sec. Exposure to the wave should not exceed tempera-
tures above 260°C for five seconds at 0.063" below the seating
plane. The packages should not be immersed in the wave.
2006-01-23
CC
and GND for all display packages.
HSDP2110S, HSDP2111S, HSDP2112S, HSDP2113S, HSDP2114S, HSDP2115S
CE
X
0
0
0
0
0
0
0
0
0
WR
1
0
0
0
0
0
0
0
0
0
RD
1
1
1
1
1
1
1
1
1
1
FL
1
1
1
1
1
1
1
1
1
1
A4
X
0
0
0
0
0
0
0
0
1
A3
X
0
1
1
1
1
1
1
1
1
A2
X
X
0
0
0
0
1
1
1
0
A1
X
X
0
0
1
1
0
0
1
1
A0
X
X
0
1
0
1
0
1
0
0
D7
X
X
X
X
X
X
X
X
X
1
CC
. Addi-
D6
X
X
X
X
X
X
X
X
X
X
D5
X
X
X
X
X
X
X
X
X
X
14
D4
X
X
0
1
1
1
1
1
1
X
Post Solder Cleaning Procedures
The least offensive cleaning solution is hot D.I. water (60°C) for
less than 15 minutes. Addition of mild saponifiers is acceptable. Do
not use commercial dishwasher detergents.
For faster cleaning, solvents may be used. Exercise care in choos-
ing solvents as some may chemically attack the nylon package.
Maximum exposure should not exceed two minutes at elevated
temperatures. Acceptable solvents are TF (trichorotrifluorethane),
TA, 111 Trichloroethane, and unheated acetone.
Note:
1)
Unacceptable solvents contain alcohol, methanol, methylene
chloride, ethanol, TP35, TCM, TMC, TMS+, TE, or TES. Since
many commercial mixtures exist, contact a solvent vendor for
chemical composition information. Some major solvent manu-
facturers are: Allied Chemical Corporation, Specialty Chemical
Division, Morristown, NJ; Baron-Blakeslee, Chicago, IL; Dow
Chemical, Midland, MI; E.I. DuPont de Nemours & Co., Wilm-
ington, DE.
For further information refer to Appnotes 18 and 19 at
www.osram-os.com
An alternative to soldering and cleaning the display modules is to
use sockets. Naturally, 28 pin DIP sockets .600" wide with .100"
centers work well for single displays. Multiple display assemblies
are best handled by longer SIP sockets or DIP sockets when avail-
able for uniform package alignment. Socket manufacturers are
Aries Electronics, Inc., Frenchtown, NJ; Garry Manufacturing, New
Brunswick, NJ; Robinson-Nugent, New Albany, IN; and Samtec
Electronic Hardward, New Albany, IN.
For further information refer to Appnote 22 at www.osram-os.com
Acceptable commercial solvents are: Basic TF, Arklone, P.
Genesolv, D. Genesolv DA, Blaco-Tron TF and Blaco-Tron TA.
D3
X
0
1
0
0
1
0
0
0
0
D2
X
1
1
0
0
1
0
0
0
1
D1
X
0
1
0
0
1
0
0
0
0
D0
X
1
0
1
1
1
1
1
1
1
Operation
Reset. No Read/Write
Within 3 Clock Cycles
Select UDC-5
Write into Row 1 of UDC-5
Write into Row 2 of UDC-5
Write into Row 3 of UDC-5
Write into Row 4 of UDC-5
Write into Row 5 of UDC-5
Write into Row 6 of UDC-5
Write into Row 7 of UDC-5
Write UDC-5 into Digit 2
(1)
Display
All Blank
All Blank
All Blank
All Blank
All Blank
All Blank
All Blank
All Blank
All Blank
(Digit 2) A