HFBR-1523Z Avago Technologies US Inc., HFBR-1523Z Datasheet - Page 4
![XMITTER FIBER OPTIC 600NM 40KBD](/photos/7/98/79836/hfbr-1523z_sml.jpg)
HFBR-1523Z
Manufacturer Part Number
HFBR-1523Z
Description
XMITTER FIBER OPTIC 600NM 40KBD
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HFBR-2521Z.pdf
(18 pages)
Specifications of HFBR-1523Z
Wavelength
660nm
Voltage - Forward (vf) Typ
2.02V
Current - Dc Forward (if)
60mA
Voltage - Dc Reverse (vr) (max)
5V
Capacitance
86pF
Connector Type
Versatile Link
Function
Ideal for solving problems with voltage isolation/insulation, EMI/RFI immunity or data security.
Product
Transmitter
Data Rate
5 MBd
Diode Capacitance
86 pF
Maximum Rise Time
80 ns (Typ)
Maximum Fall Time
40 ns (Typ)
Pulse Width Distortion
30 ns
Maximum Output Current
5.1 mA
Operating Supply Voltage
7 VDC
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Data Rate Max
495Mbps
Forward Current If
80mA
Forward Voltage
1.67V
Reverse Voltage Vr
5V
Data Transmission Distance
120ft
Wavelength Typ
660nm
Msl
MSL 4 - 72 Hours
Fiber Material
Plastic
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Spectral Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With
Plastic Optical Fiber
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-2045
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HFBR-1523Z
Manufacturer:
AVAGO
Quantity:
1 400
Versatile Link Printed Board Layout Dimensions
Horizontal Module
Interlocked (Stacked) Assemblies
Horizontal packages may be stacked by placing units
with pins facing upward. Initially engage the inter -
locking mechanism by sliding the L bracket body from
above into the L slot body of the lower package. Use
a straight edge, such as a ruler, to bring all stacked
units into uniform alignment. This tech nique prevents
potential harm that could occur to fingers and hands of
assemblers from the package pins. Stacked horizontal
Stacking Horizontal Modules
Figure 1. Interlocked (stacked) horizontal or vertical packages
4
TOP VIEW
(0.100)
2.54
DIMENSIONS IN MILLIMETERS (INCHES).
4
5
3 2
1
8
(0.300)
7.62
(0.073)
1.85
1.01 (0.040) DIA.
(0.300)
MIN.
7.62
(refer to Figure 1)
PCB EDGE
Vertical Module
packages can be disengaged if necessary. Repeated
stacking and unstack ing causes no damage to individual
units.
To stack vertical packages, hold one unit in each hand,
with the pins facing away and the optical ports on the
bottom. Slide the L bracket unit into the L slot unit. The
straight edge used for horizontal package alignment is
not needed.
Stacking Vertical Modules