VSMS3700-GS08 Vishay, VSMS3700-GS08 Datasheet - Page 5

• Manufacturer Part Number: VSMS3700-GS08
• Description: EMITTER IR PLCC-2 STD 950NM
• Manufacturer: Vishay

Specifications of VSMS3700-GS08

• Rise Time: 800 ns
• Radiant Intensity: 4.5 mW/sr
• Viewing Angle: 120°
• Current - Dc Forward (if): 100mA
• Radiant Intensity (ie) Min @ If: 1.6mW/sr @100mA
• Wavelength: 950nm
• Voltage - Forward (vf) Typ: 1.3V
• Orientation: Top View
• Mounting Type: Surface Mount
• Package / Case: PLCC-2
• Beam Angle: 60 deg
• Maximum Power Dissipation: 170 mW
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Fall Time: 800 ns
• Forward Current: 100 mA
• Forward Voltage: 1.3 V
• Mounting Style: SMD/SMT
• Peak Wavelength: 950nm
• Forward Current If(av): 100mA
• Fall Time Tf: 800ns
• Supply Voltage Range: 1.3V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 751-1258-2

SOLDER PROFILE
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
FLOOR LIFE
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
Floor life: 168 h
Conditions: T
Moisture sensitivity level 3, acc. to J-STD-020.
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
Document Number: 81373
Rev. 1.3, 03-Nov-09
Fig. 11 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
Adhesive tape
19841
300
250
200
150
100
50
0
amb
0
255 °C
240 °C
217 °C
max. ramp up 3 °C/s max. ramp down 6 °C/s
Component cavity
< 30 °C, RH < 60 %
50
Fig. 12 - Blister Tape
max. 120 s
100
Time (s)
150
For technical questions, contact:
max. 100 s
max. 30 s
200
max. 260 °C
Blister tape
Infrared Emitting Diode, 950 nm,
250
245 °C
300
94 8670
GaAs
[e-mail]
MISSING DEVICES
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
Tape leader
1.6
1.4
> 160 mm
Fig. 13 - Tape Dimensions in mm for PLCC-2
De-reeling direction
Fig. 14 - Beginning and End of Reel
4.1
3.9
3.5
3.1
Carrier leader
compartments
2.05
1.95
Vishay Semiconductors
40 empty
4.1
3.9
1.85
1.65
3.6
3.4
5.75
5.25
VSMS3700
Carrier trailer
8.3
7.7
min. 75 empty
compartments
www.vishay.com
0.25
2.2
2.0
94 8668
94 8158
4.0
3.6
326