HSMQ-C150 Avago Technologies US Inc., HSMQ-C150 Datasheet - Page 9

LED 520NM GREEN DIFF 1206

HSMQ-C150

Manufacturer Part Number
HSMQ-C150
Description
LED 520NM GREEN DIFF 1206
Manufacturer
Avago Technologies US Inc.
Type
Uni-Colorr
Datasheet

Specifications of HSMQ-C150

Package / Case
1206 (3216 Metric)
Viewing Angle
140°
Color
Green
Millicandela Rating
145mcd
Current - Test
20mA
Wavelength - Dominant
527nm
Wavelength - Peak
520nm
Voltage - Forward (vf) Typ
3.4V
Lens Type
Diffused
Lens Style/size
Rectangle, 2mm x 1.6mm
Size / Dimension
3.20mm L x 1.60mm W
Height
1.10mm
Mounting Type
Surface Mount
Resistance Tolerance
527nm
Led Size
1206
Illumination Color
Green
Lens Color/style
Diffused
Operating Voltage
3.4 V
Wavelength
527 nm
Luminous Intensity
145 mcd
Mounting Style
SMD/SMT
Package Type
Chip Led
Emitting Color
Green
Test Current (it)
20mA
Forward Current
20mA
Dominant Wave Length
527nm
Forward Voltage
3.9V
Product Length (mm)
3.2mm
Product Height (mm)
1.1mm
Product Depth (mm)
1.6mm
Mounting
Surface Mount
Peak Wavelength
520nm
Shape Type
Rectangular
Chip Material
InGaN
Main Category
Chip LED
Number Of Elements
1
Pin Count
2
Operating Temperature Classification
Commercial
Operating Temp Range
-30C to 85C
Reverse Voltage
5V
Power Dissipation
78mW
Lens Dimensions
2x1.6x0.6mm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
516-1444-2

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HSMQ-C150
Manufacturer:
AVAGO
Quantity:
50 000
Part Number:
HSMQ-C150
Manufacturer:
AVAGO/安华高
Quantity:
20 000
9
Figure 11. Recommended reflow soldering profile.
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 15. Recommended soldering pattern for HSMx-
C130/190/191/197.
0.4 (0.016)
Figure 17. Recommended soldering pattern for HSMx-C120.
0.9 (0.035)
(0.031)
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
0.8
0.2 (0.008)
0.15 (0.006)
140-160°C
(0.028)
0.7
OVER 2 MIN.
10 SEC. MAX.
4°C/SEC.
230°C MAX.
(0.059)
MAX.
(0.031)
1.5
0.8
TIME
(0.031)
5.0 (0.200)
0.8
0.8 (0.031)
(0.079)
2.0
(0.047)
1.2
0.9 (0.035)
(0.059)
0.4 (0.016)
1.5
4°C/SEC. MAX.
(0.031)
3°C/SEC. MAX.
0.8
CENTERING
BOARD
1.0 (0.039)
CENTERING
BOARD
0.7 (0.028)
Figure 12. Recommended Pb-free reflow soldering profile.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
Figure 16. Recommended soldering pattern for HSMx-C150.
Figure 18. Recommended soldering pattern for HSMx-C265.
(0.047)
(0.059)
1.2
1.5
217 C
200 C
150 C
(0.035)
(0.055)
0.9
1.4
(0.079)
2.0
(0.047)
1.2
3 C/SEC. MAX.
3 C/SEC. MAX.
60 - 120 SEC.
(0.091)
(0.059)
2.3
255 - 260 C
1.5
1.2 (0.047)
TIME
1.5 (0.059)
2.2 (0.087) DIA. PCB HOLE
(0.055)
1.4
10 SEC. MAX.
60 SEC. MAX.
6 C/SEC. MAX.
1.25 (0.049)

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