HLMP-EG55-GK0DD Avago Technologies US Inc., HLMP-EG55-GK0DD Datasheet - Page 8

LED 5MM ALINGAP 626NM RED 55DEG

HLMP-EG55-GK0DD

Manufacturer Part Number
HLMP-EG55-GK0DD
Description
LED 5MM ALINGAP 626NM RED 55DEG
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HLMP-EG55-GK0DD

Viewing Angle
55°
Color
Red
Millicandela Rating
270mcd
Current - Test
20mA
Wavelength - Dominant
626nm
Wavelength - Peak
635nm
Voltage - Forward (vf) Typ
1.9V
Lens Type
Diffused, Red Tinted
Lens Style/size
Round, 5mm, T-1 3/4
Package / Case
Radial - 2 Lead
Height
8.71mm
Mounting Type
Through Hole
Resistance Tolerance
626nm
Bulb Size
T-1 3/4 (5mm)
Led Color
Red
Luminous Intensity
400mcd
Forward Current If
20mA
Forward Voltage
1.9V
Led Mounting
Through Hole
Lens Shape
Round
Wavelength Typ
626nm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HLMP-EG55-GK0DD
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HLMP-EG55-GK0DD
Manufacturer:
AVAGO
Quantity:
50 000
Refer to application note AN5334 for more information about soldering and handling of high brightness TH Led lamps.
Example of Wave Soldering Temperature Profile for TH LED
Ammo Pack Drawing
8
(0.7087 ± 0.0197)
18.00 ± 0.50
250
200
150
100
50
0
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
(0.3593 ± 0.0246)
9.125 ± 0.625
10
(0.25 ± 0.0512)
6.35 ± 1.30
20
30
PREHEAT
TURBULENT WAVE
(0.50 ± 0.0118)
12.70 ± 0.30
40
TIME (MINUTES)
(0.50 ± 0.0394)
12.70 ± 1.00
50
CATHODE
(0.0276 ± 0.0079)
60
0.70 ± 0.20
70
LAMINAR WAVE
A
80
HOT AIR KNIFE
VIEW A–A
90
A
100
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
(0.1575 ± 0.008)
4.00 ± 0.20
(0.807 ± 0.039)
20.50 ± 1.00
TYP.

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