HLMP-EG15-RU000 Avago Technologies US Inc., HLMP-EG15-RU000 Datasheet - Page 13

• Manufacturer Part Number: HLMP-EG15-RU000
• Description: LED 5MM 635NM RED WATER CLEAR
• Manufacturer: Avago Technologies US Inc.
• Type: Uni-Colorr

Specifications of HLMP-EG15-RU000

• Viewing Angle: 15°
• Package / Case: Radial - 2 Lead
• Color: Red
• Luminous Flux @ Current - Test: 500 mlm
• Millicandela Rating: 2850mcd
• Current - Test: 20mA
• Wavelength - Dominant: 626nm
• Wavelength - Peak: 635nm
• Voltage - Forward (vf) Typ: 1.9V
• Lens Type: Clear
• Lens Style/size: Round, 5mm, T-1 3/4
• Height: 8.71mm
• Mounting Type: Through Hole
• Resistance Tolerance: 626nm
• Led Size: T-1 3/4
• Illumination Color: Red
• Lens Color/style: Untinted Non-Diffused
• Operating Voltage: 1.9 V
• Wavelength: 626 nm
• Luminous Intensity: 1500 mcd to 4200 mcd
• Operating Current: 20 mA
• Lens Dimensions: 5 mm
• Lens Shape: Dome
• Maximum Operating Temperature: + 100 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: Through Hole
• Package Type: T-1 3/4
• Emitting Color: Red
• Test Current (it): 20mA
• Forward Current: 50mA
• Dominant Wave Length: 626nm
• Luminous Flux: 0.5lm
• Forward Voltage: 2.4V
• Product Length (mm): 5.8mm
• Product Height (mm): 8.71mm
• Product Depth (mm): 5.8mm
• Mounting: Through Hole
• Peak Wavelength: 635nm
• Shape Type: Circular
• Chip Material: AlGaInP
• Main Category: Standard LED
• Number Of Elements: 1
• Pin Count: 2
• Operating Temperature Classification: Industrial
• Operating Temp Range: -40C to 100C
• Reverse Voltage: 20V
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Contains lead / RoHS non-compliant
• Other names: 516-1379

Refer to application note AN5334 for m­ore inform­ation about soldering and handling of high brightness TH LED lam­ps.
Example of Wave Soldering Temperature Profile for TH LED
Figure 10. Recommended wave soldering profile
Ammo Pack Drawing
13
(0.7087 ± 0.0197)
18.00 ± 0.50
250
200
150
100
ALL DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: THE AMMO-PACKS DRAWING IS APPLICABLE FOR PACKAGING OPTION -DD & -ZZ AND REGARDLESS OF STANDOFF OR NON-STANDOFF.
50
0
(0.3593 ± 0.0246)
9.125 ± 0.625
10
(0.25 ± 0.0512)
6.35 ± 1.30
20
30
PREHEAT
TURBULENT WAVE
(0.50 ± 0.0118)
12.70 ± 0.30
40
TIME (MINUTES)
(0.50 ± 0.0394)
12.70 ± 1.00
CATHODE
50
(0.0276 ± 0.0079)
0.70 ± 0.20
60
70
A
VIEW A–A
LAMINAR WAVE
80
HOT AIR KNIFE
A
90
100
∅
Recommended solder:
Sn63 (Leaded solder alloy)
SAC305 (Lead free solder alloy)
Flux: Rosin flux
Solder bath temperature:
245°C± 5°C (maximum peak
temperature = 250°C)
Dwell time: 1.5 sec - 3.0 sec
(maximum = 3sec)
Note: Allow for board to be sufficiently
cooled to room temperature before
exerting mechanical force.
(0.1575 ± 0.008)
4.00 ± 0.20
TYP.
(0.807 ± 0.039)
20.50 ± 1.00