HLMP-SL11-KN0ZZ Avago Technologies US Inc., HLMP-SL11-KN0ZZ Datasheet - Page 8

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HLMP-SL11-KN0ZZ

Manufacturer Part Number
HLMP-SL11-KN0ZZ
Description
LED 4MM OVAL ALINGAP2 590NM AMBE
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HLMP-SL11-KN0ZZ

Color
Amber
Millicandela Rating
595mcd
Current - Test
20mA
Wavelength - Dominant
592nm
Wavelength - Peak
594nm
Voltage - Forward (vf) Typ
2.15V
Lens Type
Clear
Lens Style/size
Oval, 4mm
Package / Case
Radial - 2 Lead
Height
6.30mm
Viewing Angle
120°, 60°
Mounting Type
Through Hole
Resistance Tolerance
592nm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HLMP-SL11-KN0ZZ
Manufacturer:
AVAGO
Quantity:
40 000
Part Number:
HLMP-SL11-KN0ZZ
Manufacturer:
AVAGO
Quantity:
50 000
8
Precautions
Lead Forming
Soldering Conditions
Figure 9. Recommended wave soldering profile.
Pre-heat Temperature
Pre-heat Time
Peak Temperature
Dwell Time
250
200
150
100
50
30
0
10
FLUXING
TURBULENT WAVE
PREHEAT
20
30
TIME – SECONDS
40
Wave Soldering
105 C Max.
30 sec Max.
250 C Max.
3 sec Max.
50
60
70
LAMINAR WAVE
HOT AIR KNIFE
80
Manual Solder
Dipping
260 C Max.
5 sec Max.
90
100
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150 C (100 C PCB)
SOLDER WAVE TEMPERATURE = 245 C
AIR KNIFE AIR TEMPERATURE = 390 C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
SOLDER: SN63; FLUX: RMA
NOTE: ALLOW FOR BOARDS TO BE
SUFFICIENTLY COOLED BEFORE EXERTING
MECHANICAL FORCE.
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
Note:
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)

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