HSML-A100-R7PJ1 Avago Technologies US Inc., HSML-A100-R7PJ1 Datasheet - Page 8

• Manufacturer Part Number: HSML-A100-R7PJ1
• Description: LED IND 609NM ORN TOP MT 2PLCC
• Manufacturer: Avago Technologies US Inc.

Specifications of HSML-A100-R7PJ1

• Package / Case: 2-PLCC
• Viewing Angle: 120°
• Color: Orange
• Millicandela Rating: 212.5mcd
• Current - Test: 20mA
• Wavelength - Dominant: 605nm
• Wavelength - Peak: 609nm
• Voltage - Forward (vf) Typ: 1.9V
• Lens Type: Clear
• Lens Style/size: Round, 2.2mm
• Size / Dimension: 3.20mm L x 2.80mm W
• Height: 1.90mm
• Mounting Type: Surface Mount
• Resistance Tolerance: 605nm
• Led Size: 3.2 mm x 2.8 mm
• Illumination Color: Orange
• Wavelength: 605 nm
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Luminous Flux @ Current - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Figure 8. Recommended Pb-free reflow soldering profile.
Figure 6. Forward voltage shift vs. temperature.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
Figure 9. Recommended wave soldering profile.
8
-0.1
-0.2
-0.3
250
200
150
100
0.5
0.4
0.3
0.2
0.1
50
30
0
-100
217 C
200 C
150 C
0
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
GaP/AlGaAs/
AlInGaP
10
-50
FLUXING
20
3 C/SEC. MAX.
PREHEAT
TEMPERATURE – °C
TURBULENT WAVE
3 C/SEC. MAX.
60 - 120 SEC.
255 - 260 C
30
0
InGaN/GaN
TIME – SECONDS
40
50
TIME
50
100
60
70
(Acc. to J-STD-020C)
LAMINAR WAVE
150
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
100 SEC. MAX.
10 to 30 SEC.
80
6 C/SEC. MAX.
90
100
Figure 7. Radiation Pattern.
1.0
0.8
0.6
0.4
0.2
0
-90
-80
-70
Figure 10. Recommended soldering pad pattern.
2.60
-60
-50
-40
ANGULAR DISPLACEMENT – DEGREES
SOLDER RESIST
-30
-20
1.50
-10
0
10
4.50
20 30
40
50
60
70
80
90