BL-22F0-0132 LIGHTING SCIENCE GROUP CORPORATION, BL-22F0-0132 Datasheet - Page 3

• Manufacturer Part Number: BL-22F0-0132
• Description: LED ARRAY RD/GRN/BLU .56X.56 SMD
• Manufacturer: LIGHTING SCIENCE GROUP CORPORATION

Specifications of BL-22F0-0132

• Color: Amber
• Current - Test: 630mA Red, 630mA Green, 210mA Blue
• Luminous Flux @ Current - Test: 59lm Red, 31lm Green, 4.2lm Blue
• Current - Max: 630mA Red, 630mA Green, 210mA Blue
• Lumens @ Current - Max: 59lm Red, 31lm Green, 4lm Blue
• Lumens/watt @ Current - Test: 31lm/W Red, 12lm/W Green, 5lm/W Blue
• Voltage - Forward (vf) Typ: 3V Red, 4V Blue, 4V Green
• Wavelength: 630nm, 523nm, 470nm
• Lens Style/size: Square, 14.1mm
• Viewing Angle: 120°
• Mounting Type: Surface Mount
• Package / Case: 0.56" L x 0.56" W x 0.1" H (14.1mm x 14.1mm x 2.54mm)
• Illumination Color: RGB
• Power Consumption: 1.5 W
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 521-1002

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To see how you can realize all these design benefits, to request a sample, or to speak with an engineer
about your design, contact Lamina Ceramics at 800.808.LTCC (5822) or visit laminaceramics.com.
Technical Data
Wavelength
Voltage*
Drive Current
Power*
Luminous Flux*
Thermal Resistance
*Note 1. Optical and Electrical specifications are given for the specified drive
current at a 25ºC junction temperature.
Part # BL-2 2 2F0-0 0 132
Typical Beam Pattern
Lamina Ceramics, 120 Hancock Lane, Westampton, NJ 08060
1-800-808-LTCC (5822) www.laminaceramics.com
Symbol
R λ
G λ
B λ
R V
G V
B V
R I
G I
B I
R P
G P
B P
R Φ
G Φ
B Φ
T
R
F
F
F
V
F
F
F
V
V
Min
624
520
465
29
15
2.1
-
-
-
-
-
-
-
-
-
-
-
Typical
0.63
0.63
0.21
1.89
2.52
0.84
2.25
4.2
59
31
3
4
4
-
-
-
Max
635
540
475
-
-
-
3
-
-
-
-
-
-
-
-
-
ºC/W
Unit
nm
nm
nm
lm
lm
lm
V
V
V
A
A
A
W
W
W
Notes
A
R
Lamina's BL Series Light
Engines are configured with
solder pads compatible with
Sn63 or Sn62 solder. As with
many electrical devices, non-
acid RMA type solder flux
should be used to prepare the
solder pads before
application of solder. If
attachment is performed with
a soldering iron, care must be
taken to minimize heat
transfer to the die and
minimize leaching of the
solderable pads.
TTACHMENT
ECOMMENDATIONS