LSM2-T/30-D12R-C Murata Power Solutions Inc, LSM2-T/30-D12R-C Datasheet - Page 3
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LSM2-T/30-D12R-C
Manufacturer Part Number
LSM2-T/30-D12R-C
Description
CONV DC/DC 125W 30A 12V SMD
Manufacturer
Murata Power Solutions Inc
Series
LSM2r
Type
Point of Load (POL) Non-Isolatedr
Datasheet
1.LSM2-T30-D12-C.pdf
(11 pages)
Specifications of LSM2-T/30-D12R-C
Output
0.8 ~ 5V
Number Of Outputs
1
Power (watts)
125W
Mounting Type
Surface Mount
Voltage - Input
8.3 ~ 13.2V
Package / Case
8-DIP SMD Module
1st Output
0.8 ~ 5 VDC @ 30A
Size / Dimension
1.30" L x 0.53" W x 0.34" H (33mm x 13.5mm x 8.6mm)
Power (watts) - Rated
125W
Operating Temperature
-40°C ~ 85°C
Efficiency
94%
Approvals
CSA, cUL, EN, UL
Output Power
150 W
Input Voltage Range
6 V to 14 V
Output Voltage (channel 1)
0.8 V to 5 V
Output Current (channel 1)
30 A
Product
Non-Isolated / POL
Input Voltage (nominal)
12 V
Package / Case Size
SMD
Output Type
Non-Isolated POL
Output Voltage
0.8 V to 5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
811-1793
811-1793-1
811-1793-1
811-1793-1
811-1793-1
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LSM2-T/30-D12R-C
Manufacturer:
TI/NSC
Quantity:
9 400
pads for increased current handling and better heat transfer. These are
indicated with the “R” designator in the model number, LSM2-T/30-D12 -C.
MPS recommends that users lay out their PC boards to accept these two
pads for larger current applications. Please note that the Derating curves for
the “R” models accept higher temperature and greater current limits than
units without the additional pads.
The LSM2-T/30-D12 is optionally available with two additional ground
Component locations
are typical.
Pad Size: 0.095 x 0.082 (2.41 x 2.08)
Optional Additional Ground
(10.92)
0.430
0.405 (10.29)
0.120 (3.05)
0.089 (2.26)
0.000 (0.00)
0.025 (0.64)
0.114
(2.9)
0.120
(3.05)
*
Not Used
2
Contact coplanarity:
0.004 (0.01)
GND (-H)
ON/OFF
3
RECOMMENDED PAD LAYOUT
ø
contacts (1.57)
0.027 (0.68)
SENSEV
0.062 ± 0.008
4
TRIM
0.950 (24.13)
0.190 (4.83)
5 EQ. SP. @
BOTTOM VIEW
www.murata-ps.com
(33.02)
5
(29.90)
1.30
1.177
OUT
6
GND
7
GND (-H)
SEQ
VIN
8
must have a substantial area of several square inches of copper etch fl ow-
soldered to these pads and suffi cient feed-throughs or other means of con-
ducting current. The “R” pads and the standard pads 1 and 2 are in parallel.
nect to these ground pads, order model LSM2-T/30-D12-C without the “R”
designator. Please observe the lower Derating curves for standard, “non-R”
models.
Pad Size: Min. 0.140 x 0.095 (3.56 x 2.08)
To realize the additional current and thermal capacity of “R” models, you
If your application uses a standard DOSA pad layout and you cannot con-
*
1
± 0.005
Optional Additional Ground
Pad Size: 0.095 x 0.082 (2.41 x 2.08)
0.080
(2.03)
0.120 (30.5)
0.048
(1.22)
0.155
(3.94)
(12.19)
(9.14)
0.075 (1.91)
0.36
0.48
(13.46)
0.53
DOSA-SMT, 30A POL DC/DC Converters
SMT contacts: copper alloy with
5μ " Au (min.) over 50μ " Ni (min.)
Dimensions are in inches (mm) shown for ref. only.
1
2
3
4
5
6
7
8
*
Components are shown for reference only.
Tolerances (unless otherwise specified):
.XX ± 0.02 (0.5)
.XXX ± 0.010 (0.25)
Angles ± 2˚
Additional Ground (optional)
Sequence/Track In
On/Off Control
Common
Not used
+Output
Sense In
+Input
Trim
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