CPC5621-EVAL-RDL Clare, CPC5621-EVAL-RDL Datasheet - Page 17

• Manufacturer Part Number: CPC5621-EVAL-RDL
• Description: LITELINK III EVALUATION BOARD
• Manufacturer: Clare
• Series: LITELINK® IIIr

Specifications of CPC5621-EVAL-RDL

• Main Purpose: Telecom, Isolation Solution
• Embedded: No
• Utilized Ic / Part: CPC5621
• Primary Attributes: Full-Wave Ringing Detection Phone Line Interface
• Secondary Attributes: Resistive AC Termination
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: CLA164; CPC5621EVAL-RDL

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Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses or indemnity are expressed or implied. Except as set
forth in Clare’s Standard Terms and Conditions of Sale, Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty relating to its
products, including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized, or warranted for use as components in systems intended for surgical implant into
the body, or in other applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a
person or severe property or environmental damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
7.2 Tape and Reel Packaging
Figure 18.
7.3 Soldering
7.3.1 Moisture Reflow Sensitivity
Clare has characterized the moisture reflow sensitivity
of this package, and has determined that this compo-
nent must be handled in accordance with IPC/JEDEC
standard J-STD-033 moisture sensitivity level (MSL),
level 3 classification.
7.3.2 Reflow Profile
For proper assembly, the component must be pro-
cessed in accordance with the current revision of
IPC/JEDEC standard J-STD-020. Failure to follow the
R04
Tape and Reel Packaging for 32-Pin SOIC Package
Embossed
Carrier
Tape and Reel Dimensions
(13.00 Dia)
330.2 Dia
Tape Thickness
(0.004 Max)
0.102 Max
Top Cover
Embossment
www.clare.com
Top Cover
(0.126
(0.106
K
K
Tape
0
1
=3.20
=2.70
±
±
www.clare.com
±
0.006)
±
0.006)
0.15
0.15
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2
recommended guidelines may cause permanent dam-
age to the device resulting in impaired performance
and/or a reduced lifetime expectancy.
7.4 Washing
Clare does not recommend ultrasonic cleaning or the
use of chlorinated solvents.
P=12.00
(0.472)
User Direction of Feed
Pb
Specification: DS-CPC5620/CPC5621 - R04
Copyright © 2008, Clare, Inc.
LITELINK
All rights reserved. Printed in USA.
10/10/08
®
is a registered trademark of Clare, Inc.
2002/95/EC
RoHS
B
(0.421
0
CPC5620/CPC5621
=10.70
A
(0.429
0
=10.90
e
±
0.006)
±
3
±
0.15
W=16.00
0.006)
(0.630
±
0.15
Dimensions
(inches)
±
mm
0.012)
±
0.30
17