KIT33984PNAEVB Freescale Semiconductor, KIT33984PNAEVB Datasheet - Page 35

• Manufacturer Part Number: KIT33984PNAEVB
• Description: KIT PRELIM EVALUATION MC3398PNA
• Manufacturer: Freescale Semiconductor
• Type: Other Power Managementr

Specifications of KIT33984PNAEVB

• Main Purpose: Power Management, High Side Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33984
• Primary Attributes: Output current monitoring, 2 SPI-selectable current ratios
• Secondary Attributes: SPI control of over-current limit, open load detection, output ON/OFF, slew rates
• Input Voltage: 6 V to 27 V
• Interface Type: SPI
• Product: Power Management Modules
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: MC33984

Device on Thermal Test Board
Analog Integrated Circuit Device Data
Freescale Semiconductor
Material:
Outline:
Area A:
Ambient Conditions:
12
11 10 9 8
12.0 mm x 12.0 mm Body
33984 Pin Connections
HS1
15
16-Pin PQFN
Transparent Top View
0.90 mm Pitch
VPWR
Single layer printed circuit board
FR4, 1.6 mm thickness
Cu traces, 0.07 mm thickness
80 mm x 100 mm board area,
including edge connector for
thermal testing
Cu heat-spreading areas on board
surface
Natural convection, still air
GND
7
14
13
6 5
A
HS0
4
16
A
3 2
1
Figure 2. Thermal Test Board
Table 2. Thermal Resistance Performance
ambient air.
die that is heated. Index n refers to the number of the die
where the junction temperature is sensed.
Resistance
R
Thermal
R
This device is a dual die package. Index m indicates the
θJAmn
θJA
A
is the thermal resistance between die junction and
Area A
(mm
300
600
0
2
)
1 = Power Chip, 2 = Logic Chip (°C/W)
m = 1,
n = 1
55
41
38
THERMAL ADDENDUM (REV 2.0)
ADDITIONAL DOCUMENTATION
m = 1, n = 2
m = 2, n = 1
42
31
29
m = 2,
n = 2
74
66
64
33984
35