EVAL-AD7706EBZ Analog Devices Inc, EVAL-AD7706EBZ Datasheet - Page 42

• Manufacturer Part Number: EVAL-AD7706EBZ
• Description: BOARD EVALUATION FOR AD7706
• Manufacturer: Analog Devices Inc

Specifications of EVAL-AD7706EBZ

• Number Of Adc's: 1
• Number Of Bits: 16
• Sampling Rate (per Second): 500
• Data Interface: Serial
• Inputs Per Adc: 3 Differential
• Input Range: 0 ~ 5.25 V
• Power (typ) @ Conditions: 6.5mW @ 500SPS
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Utilized Ic / Part: AD7706
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

AD7705/AD7706
OUTLINE DIMENSIONS
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 30. 16-Lead Standard Small Outline Package [SOIC_W]
16
Dimensions shown in millimeters and (inches)
1
1.27 (0.0500)
COMPLIANT TO JEDEC STANDARDS MS-013-AA
10.50 (0.4134)
10.10 (0.3976)
BSC
0.51 (0.0201)
0.31 (0.0122)
0.150 (3.81)
0.130 (3.30)
0.115 (2.92)
9
8
Wide Body
SEATING
PLANE
(RW-16)
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
7.60 (0.2992)
7.40 (0.2913)
2.65 (0.1043)
2.35 (0.0925)
(5.33)
0.210
MAX
PIN 1
10.65 (0.4193)
10.00 (0.3937)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
CORNER LEADS MAY BE CONFIGURED AS WHOLE OR HALF LEADS.
0.33 (0.0130)
0.20 (0.0079)
16
0.070 (1.78)
0.060 (1.52)
0.045 (1.14)
1
0.100 (2.54)
0.800 (20.32)
0.790 (20.07)
0.780 (19.81)
BSC
Figure 32. 16-Lead Plastic Dual In-Line Package [PDIP]
COMPLIANT TO JEDEC STANDARDS MS-001-AB
Dimensions shown in inches and (millimeters)
8°
0°
0.75 (0.0295)
0.25 (0.0098)
9
8
1.27 (0.0500)
0.40 (0.0157)
Rev. C | Page 42 of 44
0.280 (7.11)
0.250 (6.35)
0.240 (6.10)
0.005 (0.13)
MIN
× 45°
0.015
(0.38)
MIN
SEATING
PLANE
Narrow Body
(N-16)
0.015 (0.38)
0.060 (1.52)
GAUGE
PLANE
MAX
0.15
0.05
4.50
4.40
4.30
PIN 1
Figure 31. 16-Lead Thin Shrink Small Outline Package [TSSOP]
BSC
0.430 (10.92)
0.65
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
16
MAX
1
COPLANARITY
COMPLIANT TO JEDEC STANDARDS MO-153-AB
5.10
5.00
4.90
0.10
Dimensions shown in millimeters
0.014 (0.36)
0.010 (0.25)
0.008 (0.20)
0.30
0.19
0.195 (4.95)
0.130 (3.30)
0.115 (2.92)
9
8
1.20
MAX
SEATING
PLANE
BSC
6.40
(RU-16)
0.20
0.09
8°
0°
0.75
0.60
0.45