SSM2305-EVALZ Analog Devices Inc, SSM2305-EVALZ Datasheet - Page 14

• Manufacturer Part Number: SSM2305-EVALZ
• Description: BOARD EVAL FOR SSM2305 LFCSP
• Manufacturer: Analog Devices Inc

Specifications of SSM2305-EVALZ

• Amplifier Type: Class D
• Output Type: 1-Channel (Mono)
• Max Output Power X Channels @ Load: 2.8W x 1 @ 4 Ohm
• Voltage - Supply: 2.2 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Board Type: Fully Populated
• Utilized Ic / Part: SSM2305
• Silicon Manufacturer: Analog Devices
• Application Sub Type: Audio Power Amplifier - Class D
• Kit Application Type: Amplifier
• Silicon Core Number: SSM2305
• Kit Contents: Board
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

SSM2305
OUTLINE DIMENSIONS
ORDERING GUIDE
Model
SSM2305CPZ-R2
SSM2305CPZ-REEL
SSM2305CPZ-REEL7
SSM2305RMZ-R2
SSM2305RMZ-REEL
SSM2305RMZ-REEL7
SSM2305-EVALZ
1
Z = RoHS Compliant Part.
1
1
1
1
1
1
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
SEATING
0.90 MAX
0.85 NOM
PLANE
INDICATOR
PIN 1
12° MAX
0.95
0.85
0.75
Figure 35. 8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
3.25
3.00 SQ
2.75
VIEW
TOP
0.15
0.00
COPLANARITY
3.20
3.00
2.80
PIN 1
Figure 36. 8-Lead Mini Small Outline Package [MSOP]
0.70 MAX
0.65 TYP
0.30
0.23
0.18
0.10
Package Description
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
8-Lead Lead Frame Chip Scale Package [LFCSP_VD]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
8-Lead Mini Small Outline Package [MSOP]
Evaluation Board with LFCSP Model
COMPLIANT TO JEDEC STANDARDS MO-187-AA
0.38
0.22
8
1
3 mm × 3 mm Body, Very Thin, Dual Lead
0.65 BSC
3.20
3.00
2.80
Dimensions shown in millimeters
Dimensions shown in millimeters
2.95
2.75 SQ
2.55
0.20 REF
5
4
0.05 MAX
0.01 NOM
SEATING
PLANE
Rev. A | Page 14 of 16
0.60 MAX
5.15
4.90
4.65
1.10 MAX
0.50
0.40
0.30
(CP-8-2)
(RM-8)
0.23
0.08
0.60 MAX
EXPOSED PAD IS NOT CONNECTED INTERNAL LY.
FOR INCREASED RELIABILIT Y OF THE SOLDER
JOINTS AND MAXIMUM THERMAL CAPABILITY IT
IS RECOMMENDED THAT THE PAD BE SOLDERED
TO THE GROUND PLANE.
5
4
(BOT TOM VIEW)
EXPOSED
PAD
8°
0°
1
8
1.89
1.74
1.59
0.50
BSC
PIN 1
INDICATOR
0.80
0.60
0.40
1.60
1.45
1.30
Package Option
CP-8-2
CP-8-2
CP-8-2
RM-8
RM-8
RM-8
Branding
Y10
Y10
Y10
Y10
Y10
Y10